Optical alighment bga rework station DH-G600

Quantity	1 - 4	5 - 100
Price	USD6999	USD5500

MOQ	1 set
Port	Shenzhen
Packaging	Wooden box
Lead Time	3-7 days

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After Warranty Service	Video technical support	Power	5500W
Heater methods	Top hot air + bottom hot air + bottom IR	Temperature control	K type closed loop
Temperature accuracy	±2℃

Product Details

I. Parameters.

Power(Max)	5500W
Top heater	1200W
Bottom heater	2nd 1200W, 3rd IR heater 3000W
Power supply	220/110V 50/60Hz
Top hot air flow speed	be able to adjust by knob
Operation mode	Automatic desoldering, picking up , replacing and solderig. HD touch screen, intelligent man machine,digital system setting
Optical CCD camera lens	Foward and back move
BGA chip positioning	optical ccd alignment system + laser, fast and accurate.
Camera magnification	10x ~ 200x
Workbench fine-tuning	±15mm forward & backward, ±15mm right/left
Lighting	Taiwan LED working light , any angle adjusted
Temperature profile	5,000 groups
PCB Positioning	Intelligent positioning, PCB board can be adjusted in X,Y direction with "5 points support" , V-groove PCB bracket + universal fixturers
Temperature control	K sensor closed loop
Temperature accuracy	±1℃
PCB size	Min 2222mm , Max 390490mm
BGA chip	Min 11mm, Max 8080mm
Minimum chip spacing	0.15mm
External temp sensor	1 pcs
Dimension	L610W570H750 mm
Net weight	65kg

II. Main Features

Humanized design:

1) Embedded with
Industrial PC + Intelligent temperature module, Stable and
reliable.

2) Windows OS
interface in English and Chinese + USB interface, easy
operate.

3) With 5
different size of nozzles: upper: 31*31 mm, 38*38 mm,41*41 mm.
Bottom: 34*34 mm 55*55 mm .

4) Any size of
nozzle can be custom , Titanium alloy material, never deformed
, never rusty.

5) Adopt three
heating zones, upper heater and lower heater are hot air,
bottom is infrared preheating zone.

6)High power cross
flow fan,making the pcb board cooled fast, prevent it from
deformed.


Accurate
temperature control:

1)Three independent heaters + PID self setting adjusted + PLC
control to ensure temperature accuracy will be on ±1°C.

2)It can set 8 segments heating, and massive storage of groups
temperature profile.

3)Setting BGA heating curve conveniently and index search.

4)Automatic temperature curve analysis.


Convenient visual alignment:

1)Optical alignment system + CCD color lens system.

2)2 color separation, magnification, micro adjustment.

3)Auto focus, auto correction, auto color differentiation.

4)Light brightness adjustment system.

5)Japan japanese camera camera can move frontward and backward.

6)Built-in vacuum sucker, pick up the bga chip conveniently
after desoldering.


Precision components:

1)Precise fine-tuning knob of bge chip, adjust angle of bga
chip to alignment.

2)X, Y , Z micrometers fine-tuning, Placement accuracy will be
±0.01 mm.

3)V-groove clamp + universal fixture suitable for all kinds of
PCB.

4)Hot air nozzle with magnet, rotate in any angle, easy replace
and operate.

5)Heating system and placement head 2 in 1 design, precise
positioning.

6)Top air flow speed adjusted function, prevent tiny bga from
be moved when heating.


Perfect security design:

1)With fan failure protection, thermocouple failure protection
function.

2)Overheating protection, emergency stop function.

3)Start up password and modify protection.


Application:


Suited for all kinds of BGA repairing (CCGA、BGA、QFN、
CSP、LGA、Micro SMD、MLF...)

Lead and Lead-free