Quantity | 1 - 4 | 5 - 20 |
Price | USD8600 | USD600 |
MOQ | 1 set |
Port | Shenzhen |
Packaging | Wooden box |
Lead Time | 3-7 days |
Product Name | Automatic BGA rework station | Heating | 3 independent heaters |
Application | Rework BGA, CCGA, QFN, CSP, LGA, SMD, LED etc | Temperature control | K-type thermocouple closed loop |
Temperature accuracy | Spare parts | After Warranty Service | Spare parts |
Ⅰ .Features:
1.Optical alignment which makes a chip accurately aligned,exactly avoid misplacement even shifting;
2.Automatically remove,pick up and solder,etc. Which can be exactly instead of a veteran;
3.No damage to devices during desoldering and soldering (including damage of appearance and function);
4.The desoldering and soldering process does not affect the periphery and back of the chip;
5.For the preheating temperature, the luminous heating tube is used. The temperature increased is fast and
the constant temperature is stable, and the PCBA desoldered and soldered does not change color or deform;
6.External temperature measurement interface, convenient to detect the temperature at any time, the tem-
perature control is more accurate and reliable;
7.Touch screen operation, the program is preset in advance, without professional technical training can be
skilled in use, so that the chip disassembled and welded becomes very simple
8.Manual and automatic operation of the two modes, debugging or batch-repair are more convenient and
simple;
9.External usb interface for software updates and import of various repair data into computer analysis and
storage;
10. Disassembling and welding of lead-free or lead products are applicable;
11.Suitable for multiple patch device repair (POP, SOP, SOJ, qfq, QFN, BGA, PLCC, SCP ... );
II. Product parameter
Power supply: AC220V±10% 50/60Hz
Total Power: 6000W Upper heater: 1200W Bottom heater: 2nd heating area/ 1200W,3rd heating area/3600W
(expanded preheating square for bigger motherboards)
Dimensions: L600×W700×H850 mm
Repair product range
Repair BGA, QFN, BFP, LED lamp-beads (tape or in bulk),
special and refractory components including CGA, BHA, QEN, CSP, LGA, microSMD, MLF(microleadfeames)
Operation mode:Automatic and manual modes been optional, HD touch screen, intelligent man-machine dialogue, digitizedation
system Settings:Chip feeding With a robot hand to automatically take or put, and feed or pick.
Profile Storage: 100,000.00 groups
CCD Camera optical Alignment
Auto-stretch to open / Auto-fold for storage
Camera pixel: 2 millions, industrial-level
Resolution ratio: 1920x1080, HD 1080p, FHD support
PCBA Positioning:Up and down intelligent positioning, the bottom "5 point support" with v-type card slot fixing PCBA which can be freely adjusted in X-axis direction, with external universal fixtures
BGA position: Laser positioning v-shaped card slot and universal fixtures
Temperature control:K Sensor,Closed loop.8-channel temperature control system, PID automatic regulation
Temp accuracy: ±1℃
Position accuracy: ±0.01mm
PCB size: Max 400×450 mm Min 22×22 mm
Minimum chip spacing: 0.1mm
Safety monitoring:Full-process automatic monitoring, automatic control, automatic correction, automatic alarm hint
External Temperature Sensor: 1 pcs,(optional)
Net weight: 80kg