Automatic bga rework station DH-A5 for big motherboads

Product Details

Ⅰ. Function/Features:

1. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset;

2. Automatic disassembly, automatic welding, automatic recovery of chips, completely liberating workers;

3. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is

more efficient, and the rework of the large chip is better;

4. Laser positioning, place the motherboard in one step;

5. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant

temperature, environmental protection and energy saving, and beautiful appearance;

6. External temperature measurement interfaces, convenient for temperature detection at any time,

temperature control is more accurate and reliable;

7. Touch screen operation, preset program, which can be used proficiently without professional technical

training, making chip repair very easy;

8. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple;

9. An external USB interface is used for software updates and various repair data to be imported into the

computer for analysis and storage;

10. The large preheating temperature zone can satisfy the rework of the large motherboard of 550*650mm.

11.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)

Ⅱ. Product parameter

Power Supply: AC220V±10％ 50/60Hz

Total Power: 9200W

Top heater: 1200W

Bottom heater: 1200W

IR preheating area: 6400W (Germany heating tube, heating area of 680 *475mm)

Operation mod: Fully automatically disassemble,suction,mounting and soldering

Dimensions: L1080×W1500×H950 mm

Basic configuration:

Automatic feeding delivery system+HD digital

camera+Japanese Misumi suction rod system+Panasonic CCD

optical counterpoint system+HD digital display PC +upper

computer+Panasonic servo+Panasonic PLC+an 8-inch digital

touchscreen +Grinding level guide rail(Taiwan Hiwin)+Dalian

Institute of Technology: 10-channel temperature control system+ American Omega Temperature measurement

system+High fever efficiency and heating tube+ Resistance to 1800 degree black crystal sand glass

Chip feeding system: Automatic receiving, feeding, automatic induction (optional)

Temperature profile storage: 50000 groups

Optical CCD lens: Automatic stretch out and go back, which can be moved freely

before and after the rocker, to eliminate the "observation dead corner" problem

IR preheating area: 680×475mm

Chip angel adjust: Φ Angle can be 360° rotation, precision fine tuning fitting suction nozzle

PCBA Positioning: Up and down intelligent positioning,bottom "5-point support"

with V-groove fixed PCB which can be adjusted freely in the

X-axis direction, with universal fixtures meanwhile

BGA position: Laser positioning to quickly find the vertical point of the upper

and lower temperature zone and the central point of BGA

Temperature control: K-type Sensor,Closed loop and 8~20 segments for temperature controlling program

Temperature accuracy: ±1 ℃

Placement Accuracy: +/-0.01mm

CCD system A CCD: HD digital camera, 2 million pixels, automatic optical zoom, laser positioning

Pressure sensor: Inductive pressure greater than 10-30g (set up) will initiate collision pressure protection

Safety guard pressure sensor + infrared sensor. Double guard.

Workbench fine-tuning: Back/front±15mm,left/right±15mm

PCB size: Max 650×550 mm Min 10×10 mm

PCB thickness: 0.2-15mm

BGA chip: 2×2-100×100mm

Gas source: Built-in vacuum pump, no external gas source

BGA suction mode: Negative pressure vacuum suction, automatic induction release in place

BGA weight: 5-200g (special specification customization)

Minimum chip spacing: 0.15mm

External Temperature Sensor: 5 pcs（optional)

Machine type: Desktop table (optional)

Net weight: 150kg