Advanced automatic bga rework station DH-A6

Product Details

Ⅰ. Function/Features:

1. There are authority for supervisor and operator whose names can be changed/written/stored in, and the

serial number of the repaired PCB and the used heat profile can be stored as many as required.

2. Optical alignment, accurate chip placement and alignment, completely avoiding misalignment and offset;

3. Automatic disassembly, automatic welding, automatic recycle of chips, completely liberating workers;

4. The breeze adjustment function, adjust different wind speeds according to the size of the chip, rework is

more efficient, and the rework of the large chip is better;

5. Laser positioning, place the motherboard in one step;

6. The preheating zone adopts infrared light-emitting tube, which has fast heating, stably constant

temperature, environmental protection and energy saving, and prevent small components/dust from

dropping;

7. External temperature measurement interfaces, convenient for temperature detection at any time,

temperature control is more accurate and reliable;

8. Touch screen operation, preset program, which can be used proficiently without professional technical

training, making chip repair very easy;

9. Manual and automatic operation modes, debugging or batch repairing are more convenient and simple;

10. An external USB interface is used for software updates and various repair data to be imported into the

computer for analysis and storage;

11. The large preheating temperature zone can satisfy the rework of the large motherboard of 550*650mm.

11.Suitable for repairing a variety of SMD devices(POP,SOP,SOJ,QFP,QFN,BGA,PLCC,SCP.....)

Ⅱ. Product parameter

Power Supply AC220V±10％ 50/60Hz

Rated Power 6800W

Top heater 1200W

Bottom heater 1200W

IR preheating area 4200W (Germany heating tube, heating area of 500*350mm)

Operation mod Fully automatically disassemble,suction,mounting and soldering

Basic configuration

Automatic feeding delivery system+HD digital

camera+Japanese Misumi suction rod system+Panasonic CCD

optical counterpoint system+HD digital display PC+Panasonic

servo+Panasonic PLC+an 8-inch digital touchscreen +Grinding

level guide rail(Taiwan Hiwin)+Dalian Institute of Technology

10-channel temperature control system+ American Omega

Temperature measurement system+High fever efficiency and

heating tube+ Resistance to 1800 degree black crystal sand

glass

Chip feeding system Automatic receiving, feeding, automatic induction (optional)

Temperature profile storage 50000 groups

Optical CCD lens

Automatic stretch out and go back, which can be moved freely

before and after by rocker, to eliminate the "observation dead

corner" problem

Chip angel adjust

Φ Angle can be 360° rotation, precision fine tuning fitting

suction nozzle

PCBA Positioning

Up and down intelligent positioning,bottom "5-point support"

with V-groove fixed PCB which can be adjusted freely in the

X-axis direction, with universal fixtures meanwhile

BGA position

Laser positioning to quickly find the vertical point of the upper

and lower temperature zone and the central point of BGA

Temperature control

K-type Sensor,Closed loop and 8~20 segments for temperature

controlling program

Temperature accuracy ±1 ℃

Placement Accuracy +/-0.01mm

CCD system A CCD HD digital camera, 6 million pixels(Industrial-class),

automatic optical zoom, laser positioning

Pressure sensor Inductive pressure greater than 0.010-0.030g/c m² will initiate

collision pressure protection

Safety guard pressure sensor +emergency knob,double-guard.

Workbench fine-tuning Back/front±15mm,left/right±15mm

PCB size Max490*550 mm Min 10×10 mm

PCB thickness 0.2-15mm

BGA chip 1x1-65*65mm

Gas source External gas source

BGA suction mode Negative pressure vacuum suction, automatic induction release

in place

BGA weight 5-500g (special specification customization)

Minimum chip spacing 0.15mm

External Temperature Sensor 5 pcs（optional)

Machine type Desktop table (optional)

Dimensions L970*W850*H950 mm

Net weight 120kg