Movabel preheating zone automatic bga rework station DH-A7C

Product Details

Ⅰ. Function/Features:

1. Large preheating area which can repair the maximum size of 680*780 mm super large motherboard;

2.The lower temperature area can be moved around 360 degrees, evenly heating the pcb in every corner, to

ensure that the pcb does not deform;

3.Optical counterpoint, chip mount counterpoint precision, completely avoid dislocation offset;

4.Automatic disassembly, welding, recovery of chips, completely liberating workers;

5.The preheating area adopts infrared luminous tube, fast heating, stable constant temperature,

environmental protection and energy saving, beautiful appearance

Touch screen operation, preset program, which can be used proficiently without professional technical

training, making chip repair very easy;

6.Touch screen operation, program built-in advance, without professional technical training can be skillfully

used, so that the chip repair becomes very simple;

7.External USB interface, used for software update and upgrade and import of various repair data into

computer analysis and storage;

8.The operation panel can be pulled out to the operator for easy operation;

9.Suitable for a variety of patch devices to repair (SOP,SOJ, QFP, QFN, BGA, PLCC, SCP.....);

10. Docking MAS system function can be added if need.

Ⅱ. Product parameter

Power Supply: AC380V±10％ 50/60Hz

Total Power: 9500W

Top heater: 1200W

Bottom heater: 800W

IR preheating area: 7200W (Germany heating tube, heating area of 680 *750mm)

Operation mod

Fully automatically disassemble,suction,mounting and

soldering. The preheating area and the tray can move freely

around the X and Y axis to meet the different position

distribution of the BGA chip on the PCB

Dimensions: L1680×W1180×H1700 mm

Basic configuration

Automatic feeding delivery system+HD digital

camera+Japanese Misumi suction rod system+Panasonic CCD

optical counterpoint system+HD digital display PC +upper

computer+Panasonic servo+Panasonic PLC+a 10-inch digital

touchscreen +Grinding level guide rail(Taiwan Hiwin)+Dalian

Institute of Technology 10-channel temperature control

system+ American Omega Temperature measurement

system+High fever efficiency and heating tube+ Resistance to

1800 degree black crystal sand glass

Chip feeding system: Automatic receiving, feeding, automatic induction (optional)

Temperature profile storage: 50000 groups

Optical CCD lens

Automatic stretch out and go back, which can be moved freely

before and after the rocker, to eliminate the "observation dead

corner" problem

IR preheating area: ≥600×750mm

Chip angel adjust:

Φ Angle can be 360° rotation, precision fine tuning fitting

suction nozzle

PCBA Positioning

Up and down intelligent positioning,bottom "5-point support"

with V-groove fixed PCB which can be adjusted freely in the

X-axis direction, with universal fixtures meanwhile

BGA position

Laser positioning to quickly find the vertical point of the upper

and lower temperature zone and the central point of BGA

Temperature control: K-type Sensor,Closed loop and 8~20 segments for

temperature controlling program

Temperature accuracy: ±1 ℃

Placement Accuracy: +/-0.01mm

CCD system: A CCD HD digital camera, 2 million pixels, automatic optical

zoom, laser positioning

Pressure sensor: Inductive pressure greater than 10-30G (set up) will initiate

collision pressure protection

Safety guard: pressure sensor + infrared sensor. Double guard.

Workbench: fine-tuning Back/front±15mm,left/right±15mm

PCB size Max 680×780 mm Min 10×10 mm

PCB thickness 0.2-15mm

BGA chip 2×2-90*90mm

Gas source: External gas source + gas source filtration system

Gas media: air or nitrogen or argon (non-air media is required to add more

configuration)

BGA suction mode: Negative pressure vacuum suction, automatic induction release

in place

BGA weight: 5-200g (special specification customization)

Minimum chip spacing: 0.15mm

External Temperature Sensor: 5 pcs（optional)

Machine type: floor type

Net weight: Appro 820kg