Big floor type automatic bga rework station

Quantity	1 - 3	4 - 10
Price	USD66000	USD52000

MOQ	1 set
Port	Shenzhen
Packaging	Wooden box
Lead Time	30 days

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Product Name	Automatic BGA rework station	After Warranty Service	Video technical support
Power	220/110VAC 50/60Hz	Advantage	Automatic High Precision
Control	PLC+PC+Touch Screen

Product Details

I. Function

1. High definition optical alignment system, precise chip placement and alignment, ensuring successful repair;

2. Automatic disassembly, automatic welding, automatic chip recycling, and one click start of the entire repair process;

3. The three temperature zones are independently controlled and can be combined arbitrarily to solve various chip repair difficulties;

4. Accurate heating control system, with no impact on other components on the motherboard during heating;

5. Imported infrared wave tube preheating, fast heating and constant temperature stability, and no deformation of the motherboard after repair;

6. Touch screen operation, real-time display and automatic analysis of repair data, allowing you to instantly become a technical expert;

7. Both manual and automatic operation modes make debugging or batch repair more convenient and simple;

8. The preheating temperature zone is covered with microcrystalline panels, effectively preventing small devices from falling into the machine interior;

9. Suitable for various chip repairs (POP, SOP, SOJ, QFP, QFN, BGA, PLCC, SCP...)

II.Parameters:

power	AC220V±10％ 50/60Hz
Total Power	10000W
Top heater	1200W
Bottom heater	800W
Bottom heater	6400W (German heating pipe, heating area 640 × 500mm)
Operation mode	Fully automatic disassembly, welding, suction, and pasting integration! The upper and lower heating areas can be synchronously controlled by the joystick to move forward, backward, left, and right. The same PCB board can be disassembled from different positions without the need for repeated clamping and positioning
Basic configuration	Automatic chip feeder system+high-definition digital camera+Japanese Mismi suction rod system+Panasonic CCD optical alignment system+Panasonic servo+grinding grade guide rail (Taiwan Shangyin)+Dalian University of Technology 10 channel temperature control system+American Omega temperature measurement system+high thermal efficiency heating tube+high-temperature resistant glass
Dimensions	1500×1050×1880mm
Chip feeding system	Automatic feeding, automatic sensing (optional)
Temperature profile storage	10000group
Optical CCD lens	Automatically extend and retract, allowing for free movement of the joystick back and forth, eliminating the problem of "observation dead angles"
Chip angel adjust	ΦThe angle can be rotated 360 °, and the mounting nozzle can be precisely adjusted
Positioning	Intelligent positioning up and down, with a "5-point support" at the bottom and a V-shaped slot to fix the PCBA. The PCBA can be adjusted freely in the X direction, and is equipped with a universal fixture externally
BGA position	Laser positioning to quickly locate the vertical points between the upper and lower temperature zones and the center of BGA
Temperature control	K-type thermocouple (K Sensor) closed loop control+8-20 segment temperature control programming
Temp accuracy	±1℃
Position accuracy	0.01mm
CCD system	CCD high-definition digital camera, automatic optical zoom, laser positioning
PCB size	Max 670×640mm Min 10×10mm
Pressure sensor	Sensing pressure greater than 10-30G (configurable) will activate collision and pressure protection
Safety guard	Electronic pressure sensing protection+infrared sensing protection (optional)
Workbench fine-tuning	Front and rear ± 15mm, left and right ± 15mm
BGA chip	1X1-80X80mm
Gas source	External gas source (can be connected to inert gases such as dry air and nitrogen)
BGA absorption mode	Negative pressure vacuum suction, automatic induction release in place
BGA weight	5-200g (special specifications can be customized)
Minimum chip spacing	0.1mm
External Temperature Sensor	4, scalable（optional）
Machine type	floor type
Net weight	230KG