Automatic Ceramic Substrate DCB Defect Inspection Equipment AOI machine

MOQ	1 set
Port	Shanghai
Packaging	wooden carton
Lead Time	3-6 months

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Quick Details (View All)

Suitable object	DCB	Object size	Max：190×140mm
Sample thickness	1-2mm	Inspecting Speed	9.6s/pcs
Defect searching method	Image contrast+ logic algorithm	Detectable flaw	short-circuit,connecting line, chipped edge, residual copper, copper deficiency,

Product Details

Automatic Ceramic Substrate Defect Inspection Equipment

Function

This AOI equipment is a high-precision offline defect detection equipment for ceramic substrate, which can inspect a size of 140mm*190mm. It can be used to check defects such as chipped ceramic edges, copper surface oxidation, circuit breakage, over corrosion, dint, scratches, surface copper deficiency, dimple, wrinkles, bumps, cutting dislocation, poor plating, poor resistance welding and other defects.

Application

Production and Quality control of ceramic substrates with high quality requirements

Features

1. Combination of multiple high-resolution optical systems ;

2. Lighting design with a variety of LED line light sources;

3. Available with several kinds of marking methods to identify the defect location;

4. Multi-station detection reduces the omission ratio ;

5. Adaptable to certain level of board warp;

6. Data storage function for quality evaluation and process optimization;

Specifications

NO	Item	Parameter
01	Dimension	1930mm (L) ×1430mm (W) × 1900mm (H)
02	Weight	1500kg
03	Power Supply	AC220V+10% (Single-phase three-wire)
04	Air Supply	6-8kgf/cm2
05	Temperature/ himidity	17-35℃ / RH<70%
06	Power	Rated 10KW/ Actual 7KW
07	Language	English
Other Parameters

NO	Item	Parameter
01	Suitable object	DCB
02	Object size	Max：190×140mm；
03	Sample thickness	1-2mm
04	CCD Pixel	AOI 1：13um/Pixel AOI 2/3：24um/Pixel
05	Board warp solution	Auto focus
06	CAM format	Gerber
07	Image Processing method	CCD Color software
08	Inspecting Speed	9.6s/pcs
09	Data source	CAM+graphic scanning
10	Auxiliary function	Laser marking
11	Defect Confirmation	AOI on-line
12	Positioning Way of ceramic substrate	Automatic
13	Defect searching method	Image contrast+ logic algorithm
14	Detectable flaw	AOI 1: short-circuit,connecting line, chipped edge, residual copper, copper deficiency, copper surface stain, copper surface oxidation, cutting dislocation, ink disconnection, ink shedding, ink contamination, reverse resistance welding mark , resistance welding dislocation , resistance welding pinhole ., etc . AOI 2：dint, scratches, wrinkles, bumps； AOI 3：bubble, indentation ;