| Model Number | UMS512 | Place of Origin | ShenZhen, China |
| Brand Name | XinYi | Chipset | Unisoc Communication module |
| Supplier Type | Customization | Application | Internet of Things related fields |
| CPU | UNISOC T610 | GPU | Mali G52@650MHZ |
| Architecture | 2X ARM Cortex-A75 up to 1.8GHz + 6X ARM Cortex-A55 up to 1.6GHz | OS | Android 11.0 |
| Memory | 4GB+64GB/6GB+128GB | Display | FHD+ support (2400*1080) |
| Camera | 48 million | Network support | 2G/3G/4G full network access |
| Wireless connectivity | WiFi/Bluetooth/GPS/Beidou |
XY610 is a 4G smart module based on ZTE’s Huben T610 platform, industrial grade and high performance, running Android 11.0 operating system, supporting LTE-FDD/LTE-TDD/WCDMA/TD-SCDMA/EVDO/CDMA/GSM, etc.; supporting WiFi 5 802.11 a/b/g/n/ ac, BT v2.1+EDR, 3.0+HS, v4.1+HS, Beidou, Galileo, Glonass, GPS, QZ, etc. ac, BT v2.1+EDR, 3.0+HS, v4.1+HS, Beidou, Galileo, Glonass, GPS, QZSS; multiple audio and video input/output interfaces and rich GPIO interfaces.
The new 8-core LTE mobile chip platform, Huben T610 (UMS512), is based on a 12nm process and consists of two 1.8GHz arm Cortex-A75 CPUs and six 1.8GHz Arm Cortex-A55 processors with Mali G52 GPUs to provide a higher quality image display. With a fully upgraded image processing capability, the Huben T618 adopts the fifth-generation image engine Vivimagic solution developed by ZTE, equipped with a new 3-core ISP, supporting 48 megapixels, and a fully upgraded image algorithm, combined with innovative AI debugging tools, it will bring users a new intelligent and outstanding photo experience comparable to professional grade.


| Product Model | XY610 |
| Packaging method |
LCC,166PIN
|
| Size (mm) | 40.0×50.0×2.8 |
| Weight (g) | 10.9g |
| Network Band |
FDD-LTE:B1/B2/B3/B4/B5/B7/B8/B20/B28 TDD-LTE:B34/B38/B39/B40/B41 WCDMA:B1/B2/B5/B8 TD-SCDMA:B34/B39 EVDO/CDMA:BC0 GSM/EDGE:850/900/1800/1900MHZ |
|
GNSS
|
GPS/GLONASS/GALILEO/BEIDOU |
|
WIFI
|
2.4GHZ/5GHz |
| Application Processor | 2×A75 1.8GHz + 6×A55 1.6GHz |
| GPU | G52@650MHZ + ES3.0 25FPS |
| Memory | 4GB+64GB/6GB+128GB |
| Voltage characteristics | 3.3V~4.4V, 3.8V Type |
| operation temperature | -20℃~+70℃ |
| Dormant current |