Small Out-Line Package

Product Details

Small Out-Line Package

SOP packaging is a form of component packaging. Common packaging materials include: plastic, ceramics, glass, metal, etc., basically using plastic packaging. It has a wide range of applications and is mainly used in various integrated circuits.

Oude Electronic is a leading company engaged in the procurement and OEM/ODM of electronic components. Our primary focus is on providing high-quality SOP packaging and Small Out-Line Package solutions to our customers. We have established strong relationships with some of the most well-known brands in the industry, including Arrow, Avnet, Digikey, Future, Mouser, and more.

In addition to our extensive product line, we also offer a range of value-added services, including engineering support, supply chain management, and custom packaging solutions. Our team of experts works closely with our customers to ensure that they receive the best possible solutions for their unique needs.

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Basic Information

Name: Small Out-Line Package

Abbreviation: SOP

Packaging material: plastic, ceramic, glass, metal, etc.

Component Packaging Evolution of SOP packaging

SOP (Small Out-Line Package) is a very common component form. One of the surface mount packages, the pins are led out from both sides of the package in a gull-wing shape (L-shape). The materials are plastic and ceramic. Started in the late 1970s. From the through-hole (PTH) type before the 1980s, the mainstream product was DIP (Dual In-Line Package), which progressed to the SOP (Small Out-Line Package) derived from SMT (Surface Mount Technology) technology in the 1980s , SOJ (Small Out-Line J-Lead), PLCC (Plastic Leaded Chip Carrier), and QFP (Quad Flat Package) packaging methods. After the IC functions and the number of I/O pins gradually increased, Intel took the lead in adopting the QFP packaging method in 1997. It has been updated to BGA (Ball Grid Array) packaging. In addition, the recent mainstream packaging methods include CSP (Chip Scale Package) and Flip Chip (flip chip).

From 1968 to 1969, Philips developed the Small Outline Package (SOP). Later, SOJ (J-pin small outline package), TSOP (thin small outline package), VSOP (very small outline package), SSOP (shrink SOP), TSSOP (thin shrunk SOP) and SOT (small outline package) were gradually derived. Outline Transistor), SOIC (Small Outline Integrated Circuit), etc.

Small out Line Package Application Range

The SOP package has a wide range of applications, and gradually derived SOJ (J-pin small outline package), TSOP (thin small outline package), VSOP (very small outline package), SSOP (shrink SOP), TSSOP (thin small outline package) Miniaturized SOP), SOT (Small Outline Transistor), SOIC (Small Outline Integrated Circuit), etc. have played a pivotal role in integrated circuits. The frequency generator like the main board is the SOP package.

The application of a specific SOP package type depends on its characteristics, such as pin count, pin pitch, size, and other features. Knowing the application of a specific SOP package type can help designers select the most appropriate package for their electronic devices.

SOP Package Type	Pin Spacing (mm)	Pitch (mm)	Size (mm)	Lead Count	Application
SOIC (Small Outline Integrated Circuit)	1.27, 1.57, 2.54	0.65~1.27	3x4~10x20	8~24	Microcontrollers, Memory Devices, Power Management ICs
TSSOP (Thin Shrink Small Outline Package)	0.65, 0.8, 0.95, 1.0, 1.27, 1.5, 1.65, 1.8, 2.0	0.4~0.65	4.4x5~10x14	8~64	Microcontrollers, Memory Devices, Power Management ICs
SSOP (Shrink Small Outline Package)	0.65, 0.8, 1.0, 1.27, 1.5	0.4~0.65	5.3x6.5~10.3x15.5	20~48	Microcontrollers, Memory Devices, Power Management ICs
QSOP (Quarter-Size Small Outline Package)	0.635	0.4	2.8x2.9	16~64	Microcontrollers, Memory Devices, Power Management ICs
VQFN (Very Thin Quad Flat No-lead)	0.4, 0.5, 0.65, 0.8	0.4~0.5	2x2~12x12	16~100	Microcontrollers, Memory Devices, Power Management ICs, Sensors
DFN (Dual Flat No-Lead)	0.3, 0.4, 0.5, 0.65, 0.75, 0.8, 1.0, 1.2	0.3~0.8	1x1~12x12	2~64	Microcontrollers, Memory Devices, Power Management ICs, Sensors
QFP (Quad Flat Package)	0.4, 0.5, 0.65, 0.8	0.4~0.5	7x7~20x20	32~256	Microcontrollers, Memory Devices, Power Management ICs
LQFP (Low Profile Quad Flat Package)	0.4, 0.5, 0.65, 0.8	0.4~0.5	7x7~20x20	32~256	Microcontrollers, Memory Devices, Power Management ICs
BGA (Ball Grid Array)	0.5, 0.65, 0.75, 0.8, 1.0, 1.27, 1.5	-	3x3~50x50	16~2560	Microprocessors, Graphics Processing Units (GPUs), System-on-Chip (SoC)
CSP (Chip Scale Package)	0.3, 0.4, 0.5, 0.65, 0.8, 1.0	-	1.2x1.2~10x10	6~100	Microcontrollers, Memory Devices, Power Management

Oude Small Out-Line Package (SOP) offers a compact, efficient, and versatile solution for electronic component packaging. Our Integrated Circuit Package comes in a range of forms, sizes, and pin distances, making them suitable for a variety of applications in different industries. Contact us today to learn more about our SOP packing and how they can enhance the performance and reliability of your electronic products.