PCB Customized Multilayer PCB Circuit Prototype Circuit Board PCB Factory Quick Turn Sevices

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Model NO.	UC-1434	Processing Technology	Electrolytic Foil
Base Material	Copper	Insulation Materials	Organic Resin
Brand	UC	Specialities	BGA,Controlled Impedance
Soldermask Color	Red	Ipc Standards	Ipc Class II
Lead Time	9 Working Days	PCB Testing	E-Testing, Flying Probe Testing
Board Thickness	2.0mm	Finished Copper Thickness	All 35um
Layer Count	8 Layers	Transport Package	Vacuum Package
Specification	UL(US&Canada). ISO9001. RoHs, TS, SGS	Trademark	UC
Origin	Shenzhen, China	HS Code	8534001000
Production Capacity	20000sqm/Month

Product Details

Product Description

Top Quality Enig 12L PCB Board for Medical Electronics

Product Description

Layer:12 layer
Finished Board thickness:1.6MM
Board material:FR-4
Brand:KB
Tg aility:140
Finished Copper thickness:1 oz
Surface treatment: Enig
solder mask Colour:Green
Min hole size:0.3mm

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2. Market Distribution

3.Technical Capabilities

Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		8:1
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%