Multilayer PCB Circuit Board Fr4 PCB Printed Circuit Board Motherboard HDI PCB Peelable Solder Mask

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Model NO.	UC-3852	Production Process	Subtractive Process
Base Material	Copper	Insulation Materials	Epoxy Resin
Brand	Uc	Lead Time	5 Working Days
Material Finished Thickness	1.0mm	Special	Peelable Solder Mask
PCB Testing	E-Testing, Flying Probe Testing	Ipc Standards	Ipc Class II
Base Material Type	Fr4	Soldermask Color	Green
Surface Finish	Hal Lead Free	Board Layer	2
Size	160*180mm	Transport Package	Vacume
Specification	UL(US&Canada). ISO9001. RoHs, TS, SGS	Trademark	uc
Origin	China	HS Code	85340090
Production Capacity	20000 Sqm/Month

Product Details

Product Description

Product Describe:

Files	Gerber, Protel, Powerpcb, Autocad, Cam350, etc
Material	FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No.	1 - 30 Layers
Board thickness	0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance	±10%
Copper thickness	0.5OZ - 4OZ
Impedance Control	±10%
Warpage	0.075%-1.5%
Peelable	0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)	0.005"(0.125mm)
Min Space Width (b)	0.005"(0.125mm)
Min Annular Ring	0.005"(0.125mm)
SMD Pitch (a)	0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)	0.027"(0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005"(0.125mm)
Soldermask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
Hole size	0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Aspect Ratio	6:01
Hole Registration	0.004"(0.1mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-3u''
OSP	0.2-0.5um
Panel Outline Tol (+/-)	±0.004''(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Surface finish	HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate	ROHS ISO9001:2000 TS16949 SGS UL
Special requirements	Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger

Producr Process
Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

Requested information for PCB assembly:
1. Components list
(a) Specification, brand, footprint
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution.
(c) Schematic if necessary
2. PCB board information
(a) Gerber files
(b) PCB board processing technic
3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Package requirement

Why choose us?

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM, we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information

Our Certifications

Russia Exhibition

Packager&Shipping method
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement