OEM Manufacturer Bluetooth Headset PCB Bluetooth PCB Module with Factory

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Model NO.	UC-07011155	Processing Technology	Electrolytic Foil
Base Material	Copper	Insulation Materials	Organic Resin
Brand	UC	PCB Testing	Flying Probe Testing/E-Testing
Solder Mask Color	Green/White/Black/Blue/Red	Fast Turn	3 Working Days
Ipc Standards	Ipc Class 3	Lead Time	7 Working Days
Surface Treatment	HASL Lead Free/Immersion Gold/Immersion Silver	Finised Copper Thcikness	35/35/35/35um
Layer Count	4	Board Thickness	1.6mm
Transport Package	Vacuum Package	Specification	UL(US&Canada). ISO. RoHs, TS, SGS
Trademark	UC	Origin	Shenzhen, China
HS Code	8534009000	Production Capacity	20000 Sqm/Month

Product Details

Product Description

Ucreate LTD PCB's aim:

Customer Satisfaction is Always Our First Priority!

*Quality Policy

*Top Quality and high efficiency

*Improve continuously

*Achieve customer's satisfaction

1.Technical Capabilities

Items		Speci.	Remark
Max panel size		32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer)		4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)		5 mil(0.13mm)	hole ring width
Min thickness(inner layer)		4 mil(0.1mm)	without copper
Inner copper thickness		1~4 oz
Outer copper thickness		0.5~6 oz
Finished board thickness		0.4-3.2 mm
Board thickness tolerance control	±0.10 mm	±0.10 mm	1~4 L
	±10%	±10%	6~8 L
	±10%	±10%	≥10 L
Inner layer treatment		brown oxidation
Layer count Capability		1-30 LAYER
alignment between ML		±2mil
Min drilling		0.15 mm
Min finished hole		0.1 mm
Hole precision		±2 mil(±50 um)
tolerance for Slot		±3 mil(±75 um)
tolerance for PTH		±3 mil(±75um)
tolerance for NPTH		±2mil(±50um)
Max Aspect Ratio for PTH		8:1
Hole wall copper thickness		15-50um
Alignment of outer layers		4mil/4mil
Min trace width/space for outer layer		4mil/4mil
Tolerance of Etching		+/-10%
Thickness of solder mask	on trace	0.4-1.2mil(10-30um)
	at trace corner	≥0.2mil(5um)
	On base material	≤+1.2mil Finished thickness
Hardness of solder mask		6H
Alignment of solder mask film		±2mil(+/-50um)
Min width of solder mask bridge		4mil(100um)
Max hole with solder plug		0.5mm
Surface finish		HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger		280u"(7um)
Max gold thickness for Gold finger		30u"(0.75um)
Nickel thickness in Immersion Gold		120u"/240u"(3um/6um)
Gold thickness in Immersion Gold		2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance		50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength		≥61B/in(≥107g/mm)
bow and twist		0.75%

2.Factory touring

We can produce Epoxy Glass FR4, CEM1, CEM3, thick cooper, High TG, Aluminum, very thin and mini hard gold, keyboard on mobile battery, halogen free, Rogers with high frequency, backplane etc.

Our products have been widely used in computer, communication, network, household appliances, instruments and meters, medical device, industry control, automatic, semiconductor microelectronics LCD, LED and camera module.

3.Certificates: