OEM Electronic Double Side HASL Lead Free Fr4 Printing Circuit Board Assembly Manufacruer Other PCB & PCBA

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Model NO.	UC-16060814	Base Material	Fr4
Insulation Materials	Organic Resin	Model	PCB
Brand	Uc	Min. Hole Size	0.2mm
Board Thickness	1.6mm	Test	Flying Probe and Fixture
Certificates	UL, ISO, RoHS, Ts	Min. Line Width/Space	0.1mm
Solder Mask Type	Green	Silkscreen	White
Surface Finishing	Immersion Gold PCB	Copper Thickness	2oz
Transport Package	Vacuum Package	Specification	UL, ISO, ROHS, TS
Trademark	UC	Origin	Shenzhen, China
HS Code	85340090	Production Capacity	50000sqm/Month

Product Details

Product Description

Double Sides Enig Finish PCB High Quality PCB Board for Electronics Product

Product Description:
*Layers: Double Sides
*Base material: FR-4
*Thickness: 1.6mm
*Solder mask: Black (Green, red, yellow, white)
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold (OSP. Lead free HASL)
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)

We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.
Single-double sides pcb delivery time: 12-24 hours. 4 layer- 8 layer pcb delivery time: 48-96 hours

We focus on various pcb needs, such as LED light, customers electronics, Industrial control, Automative and other electronics, dedicated to make every customer satisfied.

1.Products Application

2. Market Distribution

3.Technical Capabilities

Files	Gerber, Protel, Powerpcb, Autocad, Cam350, etc
Material	FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic)
Layer No.	1 - 30 Layers
Board thickness	0.0075"(0.2mm)-0.125"(3.2mm)
Board Thickness Tolerance	±10%
Copper thickness	0.5OZ - 4OZ
Impedance Control	±10%
Warpage	0.075%-1.5%
Peelable	0.012"(0.3mm)-0.02'(0.5mm)
Min Trace Width (a)	0.005"(0.125mm)
Min Space Width (b)	0.005"(0.125mm)
Min Annular Ring	0.005"(0.125mm)
SMD Pitch (a)	0.012"(0.3mm)
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b)	0.027"(0.675mm)
Regesiter torlerance	0.05mm
Min Solder Mask Dam (a)	0.005"(0.125mm)
Soldermask Clearance (b)	0.005"(0.125mm)
Min SMT Pad spacing (c)	0.004"(0.1mm)
Solder Mask Thickness	0.0007"(0.018mm)
Hole size	0.01"(0.25mm)-- 0.257"(6.5mm)
Hole Size Tol (+/-)	±0.003"(±0.0762mm)
Aspect Ratio	6:01
Hole Registration	0.004"(0.1mm)
HASL	2.5um
Lead free HASL	2.5um
Immersion Gold	Nickel 3-7um Au:1-3u''
OSP	0.2-0.5um
Panel Outline Tol (+/-)	±0.004''(±0.1mm)
Beveling	30°45°
V-cut	15° 30° 45° 60°
Surface finish	HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink,
Certificate	ROHS ISO9001:2000 TS16949 SGS UL
Special requirements	Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger