1. MIP chip-level packaging technology,
high-density linear arrangement, uniform light color, no light
spots, no shadows, soft light; 2. The maximum light-emitting angle
can reach 160°; 3. The heat dissipation path is shorter and the
thermal resistance is lower. The junction temperature does not
exceed 80℃; 4. No silver plating layer, no vulcanization risk; 5.
Flexible circuit board design, can be bent at will, easy to cut,
easy to install; 6. DC 12V constant voltage drive design, safe low
voltage, small voltage drop; 7. Double-sided adhesive with high
viscosity and high thermal conductivity, easy to install and firm
to post; 8. LED solid-state light source, energy saving and
environmental protection, in line with ROHS environmental
protection standards.