1. MIP chip-level
packaging technology, high-density linear arrangement, uniform
light color, no light spots, no shadows, soft light; 2. The maximum
light-emitting angle can reach 160°; 3. The heat dissipation path
is shorter and the thermal resistance is lower. The junction
temperature does not exceed 80℃; 4. No silver plating layer, no
vulcanization risk; 5. Flexible circuit board design, can be bent
at will, easy to cut, easy to install; 6. DC 12V constant voltage
drive design, safe low voltage, small voltage drop; 7. Double-sided
adhesive with high viscosity and high thermal conductivity, easy to
install and firm to post; 8. LED solid-state light source, energy
saving and environmental protection, in line with ROHS
environmental protection standards.