High Quality 8 Layer Multilayer PCB Applied in Electronics

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Model NO.	multilayer_pcb_pcb_pwb	Processing Technology	Electrolytic Foil
Base Material	Copper	Insulation Materials	Epoxy Resin
Brand	UC	Soldmask	Green
Surface	Enig	Space	0.15mm
Thickness	1.6mm	Layer	8
Specification	UL ROHS	Trademark	UC
Origin	China	Production Capacity	100000PCS/Year

Product Details

Product Description

Detailed Product Description
Structure: 1+c+1/2+c+2
Materials: FR4 H-TG
Copper Thickness: MAX 1OZ
Dielectric Thickness: Max 3 mil
Pattern width/space: Max 4mil
Laser drill hole: Max 6mil
Layer: Max 24layer
Impedence control: 10%
Drill hole: Buried/blind/through hole
Surface treatment: HAL/HAL-LF/ENIG/IMMERSION GOLD/SILVER/TIN/GOLD FINGER etc
Production: Prototype/mass/sample/quick turn/high mixture low volume
Aluminum base board (Aluminum PCB)

Items Specification:



Max panel size	32" x 32"(800mm x 800mm)
Min trace width/ space (inner layer)	4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer)	5 mil(0.13mm)	hole ring width
Min thickness(inner layer)	4 mil(0.1mm)	without copper
Inner copper thickness	0.5~4 oz
Outer copper thickness	0.5~6 oz
Finished board thickness	0.4-3.2 mm
Board thickness tolerance control(±0.10 mm)	±0.1 mm	1~4 L
Finished board thicknes(±10%)	±10%	≥6 L
Inner layer treatment	Brown oxidation
Layer count Capability	1-24 LAYER
Alignment between ML	±2mil
Min drilling	0.15 mm
Min finished hole	0.1 mm
Hole precision	±2 mil(±50 um)
Tolerance for Slot	±3 mil(±75 um)
Tolerance for PTH	±3 mil(±75um)
Tolerance for NPTH	±2mil(±50um)
Max Aspect Ratio for PTH	8:1
Hole wall copper thickness	15-50um
Alignment of outer layers	4mil/4mil
Min trace width/space for outer layer	4mil/4mil
Tolerance of Etching	+/-10%
Thickness of solder mask(on trace)	0.4-1.2mil(10-30um)
Thickness of solder mask(at trace corner)	≥0.2mil(5um)
Thickness of solder mask(on base material)	Finished thickness+1.2mil
Hardness of solder mask	6H
Alignment of solder mask film	±2mil(+/-50um)
Min width of solder mask bridge	4mil(100um)
Max hole with solder plug	0.5mm
Surface finish	HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP,
Max Nickel thickness for Gold finger	280u"(7um)
Max gold thickness for Gold finger	30u"(0.75um)
Nickel thickness in Immersion Gold	120u---240u"(3um----6um)
Gold thickness in Immersion Gold	1u"---5u"(0.025um----0.125um)
Impedance control and its tolerance	50±10%, 75±10%,100±10% 120±10%
Trace Anti-stripped strength	≥61B/in(≥107g/mm)
Bow and twist	0.75%