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Model NO.UC-10141703 Processing TechnologyElectrolytic Foil
Base MaterialCopper Insulation MaterialsOrganic Resin
BrandUC ColorGreen Blue Red
Mask Ink ColorWhite/Black/Green/Red/Yellow/Blue Copper Thickness1oz
ConditionOriginal Made Number of Layers2 Layer
Lead Time6-8 Working Days PCB TestingE-Testing; Flying Probe Testing
CertificateISO,UL,RoHS Board Thickness1.2~2.0mm
Surface FinihsingImmersional Gold Transport PackageVacuum Packing
SpecificationIPC-Class 2 TrademarkUcreate PCB
OriginShenzhen China HS Code85340090
Production Capacity5000sq. M/Month

Product Details

Product Description

Ucreate LTD PCB's aim:

Customer Satisfaction is Always Our First Priority!

*Quality Policy

*Top Quality and high efficiency

*Improve continuously

*Achieve customer's satisfaction



1.Products Application:



2. Market Distribution:



3.Technical Capabilities:
Items Speci. Remark
Max panel size 32" x 20.5"(800mm x 520mm)
Min trace width/ space (inner layer) 4mil/4mil(0.1mm/0.1mm)
Min PAD (inner layer) 5 mil(0.13mm) hole ring width
Min thickness(inner layer) 4 mil(0.1mm) without copper
Inner copper thickness 1~4 oz
Outer copper thickness 0.5~6 oz
Finished board thickness 0.4-3.2 mm

Board thickness tolerance control
±0.10 mm ±0.10 mm 1~4 L
±10% ±10% 6~8 L
±10% ±10% ≥10 L
Inner layer treatment brown oxidation
Layer count Capability 1-30 LAYER
alignment between ML ±2mil
Min drilling 0.15 mm
Min finished hole 0.1 mm
Hole precision ±2 mil(±50 um)
tolerance for Slot ±3 mil(±75 um)
tolerance for PTH ±3 mil(±75um)
tolerance for NPTH ±2mil(±50um)
Max Aspect Ratio for PTH 8:1
Hole wall copper thickness 15-50um
Alignment of outer layers 4mil/4mil
Min trace width/space for outer layer 4mil/4mil
Tolerance of Etching +/-10%
Thickness of solder mask on trace 0.4-1.2mil(10-30um)
at trace corner ≥0.2mil(5um)
On base material ≤+1.2mil
Finished thickness
Hardness of solder mask 6H
Alignment of solder mask film ±2mil(+/-50um)
Min width of solder mask bridge 4mil(100um)
Max hole with solder plug 0.5mm
Surface finish HAL (Lead or Lead free), immersion Gold, Immersion Nickel, Electric Gold finger, Electric Gold, OSP, Immersion Silver.
Max Nickel thickness for Gold finger 280u"(7um)
Max gold thickness for Gold finger 30u"(0.75um)
Nickel thickness in Immersion Gold 120u"/240u"(3um/6um)
Gold thickness in Immersion Gold 2u"/6u"(0.05um/0.15um)
Impedance control and its tolerance 50±10%,75±10%,100±10% 110±10%
Trace Anti-stripped strength ≥61B/in(≥107g/mm)
bow and twist
0.75%


4.Products Equipment:


Product Description:

*Layers: 1-22
*Base material: FR-4 CEM-1
*Thickness: 0.2-5.0mm
*Solder mask: Green, black, red, yellow, white
*Min. Line width: 0.075mm
*Min. Line space: 0.075mm
*Min. Hole diameter: 0.1mm
*Surface treatment: Immersion gold, OSP. Lead free HASL.
*Blind/buried via holes: OK
*lead time: Seven to ten days (HDI: About 30 days)

We can also make quick pcb. As customers plates copied from the PCB, PCB design, prototype production, production, processing, and other SMT one-stop service.

Single-double sides pcb delivery time: 12-24 hours
4 layer- 8 layer pcb delivery time: 48-96 hours

We specilized in :

Ucreate is specialized in the production of a variety of single, double, high multi layers, HDI, the metallic substrate and FPC PCB. With laser drilling machine, CNC drilling machine, automatic machine, automatic exposure machine, large-scale lamination machine, Automatic flow production line, auto panel plating line, auto P.T.H Line, and other precision production equipments and AOI testing machine, flying probe tester machine and other advanced detection equipments.

Production processes:

Material Receiving → IQC → Stock → Material to SMT → SMT Line Loading → Solder Paste/Glue Printing → Chip Mount → Reflow → 100% Visual Inspection → Automated Optical Inspection (AOI) → SMT QC Sampling → SMT Stock → Material to PTH → PTH Line Loading → Plated Through Hole → Wave Soldering → Touch Up → 100% Visual Inspection → PTH QC Sampling → In-Circuit Test (ICT) → Final Assembly → Functional Test (FCT) → Packing → OQC Sampling → Shipping

PCB assembly Equipment:

1. High speed and precision chip placer or multi-function SMD mounter
2. Wave soldering machine
3. Vacuum machine
4. High temperature box
5. Auto-solder paste printer
6. Hot- and mixed-air reflow


Requested informations for PCBA:
1. Components list
(a) Specification, brand, footprint
(b)To short the lead time, please kindly advise us if there is any acceptable components substitution.
(c) Schematic if necessary

2. PCB board information
(a) Gerber files
(b) PCB board processing technic

3. Testing Guide & Test Fixtures if necessary
4. Programming files & Programming tool if necessary
5. Package requirement



Why Choose Us?

1. Your inquiry related to our products or prices will be replied in 24hrs.

2. Well-trained and experienced staffs to answer all your enquires in fluent English

3. OEM&ODM, we can help you to design and put into product.

4. Distributorship are offered for your unique design and some our current models

5. Protection of your sales area, ideas of design and all your private information



Trade Terms:

1. Payment: T/T in advance (Western Union , payple is welcomed)

2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.

3. Sample can be delivered in 3days

4. Shipping freight are quoted under your requests

5. Shipping port: Shen zhen,Mainland China

6. Discounts are offered based on order quantities

7. MOQ: 1PCS



Package &Shipping Methods:

1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement



Certificates:

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