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Quick Details:3mil/3mil, HDI , Impedance control, Half Holes
|
Base Material |
Fr4 TG170 |
|
Board Thickness |
1.0 mm |
|
Copper Thickness |
1OZ(outer) , 0.5OZ(inter) |
|
Min. Hole Size |
4mil (0.1mm) |
|
Min. Line Width/ Spacing |
3mil (0.076mm)/3mil (0.076mm) |
|
Solder mask Color |
Blue |
|
Silkscreen Color |
White |
|
Surface Finishing |
Immersion Gold |
|
Min.Quantity of Order |
No MOQ |
|
Certificate |
UL, ISO 9001, ISO 14001 |
|
HDI Step |
1+4+1 |
|
Impedance control |
50 ohms, 100 ohms |
|
Difficulty |
1 Step HDI + Impedance control + Half Holes |
Block 5-A, Tongtai Times Center, Fuyong Town, Shenzhen 518103, Guangdong, China
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