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Quick Details: 4OZ, TG170, 12mil /12mil
|
Base Material |
Fr4 TG170 |
|
Layer Counts |
12L |
|
Board Thickness |
3.2 mm |
|
Copper Thickness |
4OZ |
|
Min. Hole Size |
16mil (0.4mm) |
|
Min. Line Width/ Spacing |
12mil (0.3mm)/12mil (0.3mm) |
|
Solder mask Color |
Green |
|
Silkscreen Color |
None |
|
Surface Finishing |
ENIG |
|
Min.Quantity of Order |
No MOQ |
|
Certificate |
UL, ISO 9001, ISO 14001 |
|
Difficulty |
Heavy Copper |
Block 5-A, Tongtai Times Center, Fuyong Town, Shenzhen 518103, Guangdong, China
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