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| Place of Origin | Guangdong, China (Mainland) | Brand Name | FS |
| Model Number | printed circuit board assembly | Base Material | FR-4,Hi-TG FR4,CEM-1,CEM-3 |
| Copper Thickness | 0.3oz-3oz | Board Thickness | 1.6mm |
| Min. Hole Size | 0.1mm | Min. Line Width | 0.2mm |
| Min. Line Spacing | 0.2mm | Surface Finishing | HASL Lead Free, Immersion gold |
| Layer No. | 1-32 Layers | PCB Test | Flying probe and AOI (Default)/Fixture Test |
| Base, Cover film, Stiffeners thickness: | 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um | BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) |
| PCB Assembly Method | SMT, Through-hole, Mixed, BGA | PCB Assembly Test | Visual Inspection (default), AOI, FCT, X-RAY |
| Hi-TG FR4 Material | Tg-130 Tg-140 Tg-160 Tg-170 | Electrical Testing | Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test |
| Certificate Standard | IPC-A-600H Class 2, Class 3, TS16949,UL,ROHS and as your need | Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering etc. |
Room 10A16, 10/F, Yilida Building 2, Nanshan Road, Nanshan District
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