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| Place of Origin | Guangdong, China | Number of Layers | 2-20 Layer |
| Base Material | FR-4 (130u2103Tg-180u2103Tg),CEM3,etc | Copper Thickness | 1/3OZ-3OZ |
| Board Thickness | 0.3mm-3.2mm | Min. Hole Size | 0.15mm |
| Min. Line Width | 0.075mm | Min. Line Spacing | 0.075mm |
| Surface Finishing | HASL,ENIG,immersion silver,immersion tin,OSP. | Type | RIGID |
| Shape | Square,circle,irregular(with jigs) | Cutting | Shear, V-score, Tab-routed |
| Finished Board Size(Max) | 560mm*710mm | Warp age(Min) | ≤0.7% |
| Solder Mask Bridge(Min) | 2. 5mil (0.064mm) | Dimension Tolerance (Hole to Edge)(Min) | ±4mil ( ±0.101mm) |
| Ionic Contamination | <1.56ug/cm2(NaCl) | Peel Strength | ≥1.4N/mm |
| Natural Impedance Control | ±10% |
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