SHINELF Tda7294 5.1 home theater Bluetooth Headset PCB Circuit Board Boards Amplifier Module Audio Power Amplifier PCB Board

FOB Price 0.1 - 50 USD / Piece

MOQ	1 Piece/Pieces

Quick Details (View All)

Supplier Type	Bluetooth Circuit Board	Model Number	SH009
Place of Origin	Guangdong, China	Product name	SHINELF Bluetooth Headset Circuit Board PCB
Product type	OEM Rigid PCB	Usage	PCB Manufactur And Assembly
Application	bluetooth pcb,audio pcb board	Material	FR4 94v0 Circuit Board
Color	Green Blue Black Red White And Other	Function	circuit board assembly
Layer	4-22 layers	PCB test	High-stringency 100% Visual Inspection
PCB Assembly Method	Mixed SMD SMT DIP

Product Details

When you order PCBs from SHINELF, you are buying quality that pays for itself over time. This is guaranteed through a product specification and quality control that is far more stringent than other suppliers, and ensures that the product delivers what it promises. Furthermore, thanks to SHINELF’s considerable purchasing power, the factories are willing to adapt to our requirements.

Quality pays for itself in the long run even if not apparent at first sight At first sight, PCBs differ little in appearance, irrespective of their inherent quality. It is under the surface that we focus on the differences so critical to the PCBs’ durability and functionality. Customers cannot always see the difference, but they can rest assured that SHINELF puts a great deal of effort into ensuring that in turn, their customers are also supplied with PCBs that meet the most stringent quality standards. It is vital that PCBs function reliably both during the manufacturing assembly process and, out in the field. Apart from the costs involved, faults during assembly can end up being built into the final product via the PCBs, with possible failure in the field resulting in compensation claims. Relative to that, in our opinion, the cost of a premium quality PCB is negligible. In all market sectors, particularly those producing products with critical applications, the consequences of such failures could be devastating. Such aspects must be considered when comparing PCB prices. Reliability and a guaranteed long life cycle involve an initially higher outlay, but will pay for themselves in the long run.

Multilayer PCBs – Technical specification

Feature	SHINELF Multilayer PCBs Technical specification
Number of layers	4 – 22 layers standard, 30 layers advanced, 40 layers prototype.
Technology highlights	Multiple layers of epoxy glass fiber bonded together with multiple layers of copper of varying thicknesses.
Materials	High performance FR4, halogen-free FR4, low loss and low Dk materials
Copper weights (finished)	18μm – 210μm, advanced 1050μm / 30oz
Minimum track and gap	0.075mm / 0.075mm
PCB thickness	0.40mm – 7.0mm
Maxmimum dimensions	580mm x 1080mm, advanced 610mm x 1400mm
Surface finishes available	HASL (SnPb), LF HASL (SnNiCu), OSP, ENIG, Immersion Tin, Immersion Silver, Electrolytic gold, Gold fingers
Minimum mechanical drill	0.20mm

HDI PCBs – Technical specification

Feature	SHINELF HDI PCBs Technical specification
Number of layers	4 – 22 layers standard, 30 layers advanced
Technology highlights	Multilayer boards with a higher connection pad density than standard boards, with finer lines/spaces, smaller via holes and capture pads allowing microvias to only penetrate select layers and also be placed in surface pads.
HDI builds	1+N+1, 2+N+2, 3+N+3,4+N+4, any layer in R&D
Materials	FR4 standard, FR4 high performance, Halogen free FR4, Rogers
Copper weights (finished)	18μm – 70μm
Minimum track and gap	0.075mm / 0.075mm
PCB thickness	0.40mm – 3.20mm
Maxmimum dimensions	610mm x 450mm; dependant upon laser drilling machine
Surface finishes available	OSP, ENIG, Immersion tin, Immersion silver, Electrolytic gold, Gold fingers
Minimum mechanical drill	0.15mm
Minimum laser drill	0.10mm standard, 0.075mm advanced

Radio Frequency PCBs – Technical specification

Feature	SHINELF Radio Frequency PCBs Technical specification
Number of layers	2-20 layers
Technology highlights	Controlled impedance, low loss materials, miniaturization
Materials	Low loss / low Dk, higher performance FR-4, PPO, Teflon, hydrocarbon / ceramic filled
Dielectric thickness	0.1mm – 3.0mm
Profile method	Routing, v-score
Copper weights (finished)	½ to 6 ounce
Minimum track and gaps	0.075mm / 0.075mm
Metal core thickness	0.4-2mm post bonded
Maxmimum dimensions	580mm x 1010mm
Surface finishes available	HASL (Lead-free), OSP, ENIG, Immersion tin, Immersion silver

Flexible PCBs (Flex)

Feature	SHINELF Flexible PCBs (Flex)
Number of layers	1 – 6L
Technology highlights	Mainly polyimide materials, flex PCB’s are necessary when motion of the PCB is needed, when 3-D interconnections are necessary(i.e. replacing cables and connectors) or when these are both combined due to limited available space.
Materials	Polyimide, Polyester
Profile method	Laser cutting, punching, rout
Copper weights (finished)	18μm – 70μm
Minimum track and gap	0.075mm / 0.075mm
PCB thickness	0.05mm – 0.80mm
Maxmimum dimensions	450mm x 610mm
Surface finishes available	OSP, ENIG, Immersion tin, Electrolytic gold, Gold fingers
Minimum mechanical drill	0.15mm

Rigid-Flex PCBs – Technical specification

Feature	SHINELF Rigid-Flex PCBs – Technical specification
Number of layers	4-16 layers
Technology highlights	Mixed materials including RF and high speed, standard FR-4, polyimide flex. Adhesiveless or adhesive based polyimide flexconstructions, with cover coat or flexible solder mask materials.
Bending performance	Based on the specific design, the bend performance can range from a basic 90 °bend to fit to a full dynamic flex with 360° rangeof motion in the flex tail that will withstand continuous cycles throughout the product life.
Bend features	Bend radius controls the flexibility of the flex portion of the board. The thinner the material the lower the bend radius and the more flexible the flex section
Materials	RA copper, HTE copper, FR-4, polyimide, adhesive
Copper weights (finished)	½ ounce, 1 ounce, 2 ounce, 3 ounce
Minimum track and gap	0.075mm / 0.075mm
PCB thickness	0.4mm to 3mm
PCB thickness in flex section	0.05mm to 0.8mm
Maxmimum dimensions	457mm to 610mm
Surface finishes available	ENIG, OSP Immersion tin, Immersion silver
Minimum mechanical drill	0.20mm

Double sided PCBs

Item	Processing Capacity	Process Details
Number of layers	2 layers
Ink	Sun series	White oil: Sun 2000 series, green oil: Sun 07 series
Plate type		FR-4 standard, FR-4 high performance, FR-4 halogen-free.
Dimensional accuracy	±0.15mm	CNC shape tolerance ±0.15mm, V-cut board shape
Thickness range	0.2-2.4mm	Current plate thickness: 0.4/0.6/0.8/1.0/1.2/1.6/2.0/2.4 mm
Thickness tolerance( t≥1.0mm)	± 10%	Please pay attention to this point: due to the production process (sink copper, solder mask, pad spraying will increase the thickness of the board), generally go to the right tolerance
Thickness tolerance ( t