Thermal Conductivity | 2.0 W/m.K | Hardness | 80 ShoreD |
Mix Ratio | 1:1 |
Whether you prefer room temperature (RT) cure or heat cure, our
versatile solution offers ease of handling, soft application, and
outstanding thermal conductivity, setting a new standard in
thermal management.
Key Features:
1. RT Cure or Heat Cure:
Enjoy flexibility in your curing process. Our thermal interface
material adapts to your preferences, allowing for either room
temperature cure or heat cure, providing convenience and
versatility in your application.
2. Designed for Efficient Heat Transmission:
Elevate your thermal management with an adhesive designed
specifically for efficient heat transmission between components
and heatsinks. Ensure optimal performance and longevity in your
projects.
3. Easy Handling, Soft, and Excellent Thermal Conductivity:
Experience unparalleled ease of use with our material's easy
handling and soft application. Despite its softness, it delivers
exceptional thermal conductivity, guaranteeing efficient heat
transfer without sacrificing handling convenience.
4. Complied with UL-94 V0:
Prioritize safety with our material's UL-94 V0 compliance. Rest
easy knowing that your projects meet stringent flame resistance
standards, ensuring an added layer of protection.
Specifications:
Room 02, Floor 11, Unit 2, Building 3, Xinli Garden (Phase II), No. 1 Detong Road, Shuikou Street Office, Huizhou urban district, Huizhou City, Guangdong Province, China