Post Saw Wafer AOI

Product Details

Alpha is a series of high-performance Wafer AOI solutions that automatically detect major or minor wafer defects while providing reliable and precise results. It’s supported various types of wafer in semiconductor, electronics, automotive, and medical, Optoelectronic industry. It's designed to support inspection before and after sawing process.

• supported 6",8",12" wafer size (Film frame carrier)
• Detect defects down to 0.5um - 0.8um
• Minimum size for inspected die is 200um x 200um
• Able to adapt to host map format (Klarf, XML and etc)
• Live inspection results display & Auto Mapping Feature
• Provide flexibility of defects review through verification software
• HEPA filter to prevent dust & foreign materials
• Able to proceed with the inspection regardless of die missing rows or in die shedding condition due to die expansion
• Auto Lens Change Feature provides more choices of magnification inspection without hardware change or conversion
• Real-Time & High Speed Autofocus Feature helps to solve wafer warp issues and enables consistent, high-resolution image capture.