MOQ | 1 Piece/Pieces |
Port | SZ |
Packaging | - |
Place of Origin | Guangdong, China (Mainland) | Brand Name | HSD |
Model Number | TU05 | Base Material | Aluminum Base |
Copper Thickness | 1 Oz | Board Thickness | 0.4-3.0mm |
Min. Hole Size | 3mil (0.075mm) | Min. Line Width | 0.1mm(Flash Gold)/0.15mm(HASL) |
Min. Line Spacing | 4/4mil(0.1/0.1mm) | Surface Finishing | Immersion Gold |
Application | Communications | Laminate: | FR-4,Halogen free,High TG etc |
Board thickness: | 3-3.5mm | Solder mask: | Green,Black,Blue,Red, white etc |
Capacity: | up to 50,000u33a1/month | Blind & Buried vias: | Yes |
Impedance control tolerance: | u00b110% | Testing: | 100% E-Testing |