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MTK8390 Android 13 core board Customized development PCBA Android board Internet of Things solution provider

FOB Price 80 - 80 USD / pieces

Quick Details (View All)

DescriptionAndroid Smart Board Model NumberXY8390
TypeDevelopment Board Place of OriginShenZhen, China
Brand NameXinYi Core ProcessorMediaTek MT8390
Operating SystemAndroid PlatformMediaTek MTK
Processor2xA78 2.2GHz + 6xA55 2.0GHz GPUMali-G67 MC3 45fps
NPU4.4T OSAndroid & Linux
Memory4GB+64G/6G+128G/8G+256G Network support1000M Ethernet
Camera interface2xMIPI CSI(4 Data lanes)16MP @ 30fps video decodeAV1/VP9/HEVC/H.264 4K 75fps
video encode4K 30fps H.264/ HEVC Size (mm)45x45x2.3

Product Details

Product Description

The XY8390ZA core board is based on MT8390 (Genio 700) and is a highly integrated and powerful platform designed specifically for various artificial intelligence (AI) and Internet of Things (IoT) use cases. The processor uses Arm ® DynamIQ ™ Technology, combined with high-performance Cortex-A78 core and high-efficiency Cortex-A55 core, equipped with Arm Neon ™ Engine. Single core AI processor (APU) cadence with AI accelerator (AIA) ® Tensilia ® VP6 processor, single core Cadence HIFI 5 audio engine DSP, with memory data rate higher than LPDDR4 (X) -3733, multiple hardware interfaces, and up to 5 video output ports (HDMI/eDP/DP/MIPI/DPI).

 

The XY8390ZA core board adopts a high-efficiency 6nm process technology, coupled with an eight core CPU, including 2 2.2GHz A78 and 6 2.0GHz A55 cores, high-performance GPU Arm Mali-G57, and up to 8GB of four channel LPDDR4X memory and UFS flash memory. Genio 700 supports both Yocto Linux operating system and Android system, making it a high-performance edge artificial intelligence IoT platform that can be applied in fields such as smart retail, industry, and smart home.

specification

Networt band

Type Network band 
WiFi 802.11a/b/g/n/ac WiFi 2T2R 2400~2497MHz/5150~5350MHz/5470~5850MHz 5725~5850MHz/5850~5925MHz
BT5.1 2400~2483.5MHz

*Note: The frequency band is subject to specific shipment.

 

XY8390 is a SMT module, packaged in BGA314_ 45x45, with a total of 314 pins. It can be embedded in various M2M product applications through solder pads, making it very suitable for developing mobile devices such as in car computers, multimedia terminals, smart homes, and IoT terminals.

 

Main performance parameters

Process
6nm
Application Processors 2xCortex-A78 up to 2.2GHz + 6xCortex-A55 up to 2.0GHz
GPU Mali-G67 MC3 45fps
Camera interface 2xMIPI CSI(4 Data lanes)16MP @ 30fps
video decode AV1/VP9/HEVC/H.264 4K 75fps
video encode 4K 30fps H.264/ HEVC
Display 4K60+4K30 MIPI 4 lanex2, Edp 2lane,DP 4lane, HDMITX 2.0,DPI
APU 1xVP6,1XMDLA3.0 3.4TOPs

 

 

Other performance parameters 

Performance Description
Electricity supply

VSYS power supply voltage range: 3.5V~4.35V

Typical power supply voltage: 4.2V

WLAN features Compliant with IEEE 802.11 a/b/g/n/ac standard, 2.4G supports 20/40M bandwidth, 5G supports 20/40/80M bandwidth dual band 2T2R mode, data rate up to 867Mbps, supports MU MIMO RX, optional external LNA and PA support
Bluetooth features Bluetooth V5.1+BLE, compatible with Bluetooth V4.2
Serial NOR Flash NOR Flash capacity up to 512Mbit, SPI clock up to 52MHz
EMMC EMMC5.1/1.8/HS400 x1
DDR

High fidelity 8G bytes @ 4 CH x LPDDR4 (x) 3733MHz

Maximum support 8G bytes @ 4 CH x DDR4 3200MHz

PCIE PCIE Gen2,1-lane,RC mode
Ethernet Gigabit Ethernet (RGMII) interface
Audio Interface

Audio input:

3 sets of analog microphone inputs, MIC0 is the main microphone, and MIC2 is the call noise reduction MIC

1 headphone MIC input

4-way DMIC

3-way SPDIF IN

2-way I2S IN

Audio output:

Stereo Headphone Output

Differential output to external audio amplifier

1-way SPDIF OUT

2-way I2S OUT

USB Interface

USB2.0 DRD *2 + SS USB3.1 Gen1 DRD

USB 3.1 data transfer rate maximum 5.0Gbps

DP Interface DP V1.4, 4 x lanes with each channel up to 5.4Gbps
eDP Interface DP V1.2, 2 x lanes up to 5.4Gbps per channel
HDMI Interface HDMI 2.0 supports 3D HDMI, SD mode, HD/FHD/UFHD mode
SDIO Interface

Supports SD/SDHC/MS/MSPRO/MMC/SDIO 2.0/SDIO 3.0,4bit SDIO

Supports hot swapping

I2C Interface 5 * I2C+2 * I3C, the maximum speed of I2C can reach 400K, and when using DMA with I2C, the maximum speed can reach 3.4Mbps, which is used for peripheral devices such as TP, Camera, Sensor, etc
SPI Interface 6 sets of SPI interfaces, SPI0 supports single/dual/quad mode to 52Mbit/s quad mode only, SPI1-5 supports single/dual mode to 52Mbit/s, supports TX and RX DMA modes.
ADC Interface 5-way, used for universal 12 bit ADC, Input range=0.05~1.45V
Antenna Interface 2 WiFi antennas, 1 BT antenna
Physical Characteristics

Size: 45±0.23×45±0.23×2.3±0.12 mm

Interface: BGA314

Warpage:

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