Mobile Phone Motherboard Multilayer PCB Manufacturer

FOB Price 0.1 - 5.2 USD / Piece

MOQ	1 Piece/Pieces

Quick Details (View All)

Place of Origin	Guangdong, China	Brand Name	Semshine
Model Number	spcb-0008	Number of Layers	4-LAYER
Base Material	FR4	Copper Thickness	70um
Board Thickness	1.2mm	Min. Hole Size	0.2mm
Min. Line Width	0.075mm	Min. Line Spacing	0.075mm
Surface Finishing	plated gold	Board Size	Customization
Board Thickness Tolerance	+/-10%	V-cut angle	25°,30°,45°,60°
Twist&Wrap	≤ 0.5%	Soldermask	Red
Certificate	ROSH. ISO9001, UL Certificate	Inner packing	Vacuum packing,Plastic bag
Outer packing	Standard carton packing	Tolerance of Etching	±1mil(±25um)
used for	Electronic products	Product name	mobile phone motherboard multilayer PCB manufacture

Product Details

Products Description

1	Description	PCB Specification
2	Material	FR-4/HTG150-180 FR-4/CEM-1/CEM-3/Aluminum
3	Layer	1-20
4	Board Thickness	0.2mm- 4.0mm
5	Board Thickness Tolerance	+/-10%
6	Copper thickness	17.5um-175um (0.5oz-5oz)
7	Min Trace Width	0.15mm
8	Min Space Width	0.15mm
9	Min Drilling Dia	0.2mm
10	PTH copper thickness	0.4-2mil(10-50um)
11	Tolerance of Etching	±1mil(±25um)
12	V-cut angle	25°,30°,45°,60°
13	Pearl Strength of line	≥ 6lb/in(≥ 107g/mm)
14	Impedance control and tolerance	50Ω±10%
15	Twist&Wrap	≤ 0.5%
16	Soldermask	Green, Red, Blue, White, Black, Yellow
17	Surface Finish/Plating	HASL/Lead Free HASL/OSP/Gold Plating/Immersion Gold/ENIG
18	Certificate	ROSH. ISO9001
19	File	Protel 99se/P-CAD/Autocad/Cam350
20	Inner packing	Vacuum packing,Plastic bag
21	Outer packing	Standard carton packing