Model Number | MEGA-IDEA Black Reballing Stencil | Place of Origin | Guangdong, China (Mainland) |
Application: | Reballing/ BGA/ Rework | Type | For iPhone and Android chips |
Color | Black | Material | Imported Japanese steel |
Weigh | 25g | Operating Temperatures | -50C - 500C |
Size | 80x80mm or 80x100mm | Package | Paper and Plastic |
Package dimensions | 175x112 mm |