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| MOQ | 1 Piece/Pieces |
| Port | Dalian/Shenzhen |
| Packaging | Manufacturing pcb assembly manufacturers sim fpcs packaging details PCB: Vacuum, Foam and carton box PCBA: Anti-static bubble bag, foam and carton box |
| Lead Time | - |
| Place of Origin | Liaoning, China (Mainland) | Brand Name | JINSEO |
| Model Number | Custom Rigid-Flexible PCB | Base Material | polyimide,polyester,Rogers |
| Copper Thickness | 35um,17um,18um | Board Thickness | 1.6mm(62mil) |
| Min. Hole Size | 0.2mm(8mil) | Min. Line Width | 0.1mm(4mil) |
| Min. Line Spacing | 0.1mm(4mil) | Surface Finishing | OSP, Immersion gold,ISn,ENIG |
| Item | Manufacturing pcb assembly manufacturers sim fpc | Material | Polyimide, Kapton, Teflon/Duroid, FR4, Getek, Thermount, Epoxy |
| PCB Assembly Method | SMT, Through-hole, Mixed, BGA | PCB Assembly Test | Visual Inspection (default), AOI, FCT, X-RAY |
| BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) | Electrical Testing | Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test |
| Certificates | RoHS and UL (Default) | Base, Cover film, Stiffeners thickness | 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil0.10um |
| PCB Test | Flying probe and AOI (Default)/Fixture Test | Standard | IPC-A-600H Class 2, Class 3, TS16949 |
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