MA2012D

Product Details

Whether you prefer room temperature cure or a rapid cure under heating, our solution provides excellent adhesive force and high reliability performance with metal, outstanding high-temperature bonding strength, and superior environmental resistance.

Key Features:

1. Long Open Time:
Enjoy extended flexibility in your application processes with our adhesive's long open time. This feature allows for precise adjustments and meticulous bonding, ensuring optimal results.

2. Room Temperature Cure or Fast Cure Under Heating:
Tailor your curing process to your specific requirements. Choose between room temperature cure for convenience or opt for a fast cure under heating to accelerate your project timelines without compromising on strength.

3. Excellent Adhesive Force and High Reliability with Metal:
Trust in the strength of your bonds. Our adhesive excels in adhesive force, establishing reliable connections with various metals. Experience high reliability performance, ensuring your bonds withstand the test of time.

4. Excellent High-Temperature Bonding Strength:
Elevate your projects with outstanding high-temperature bonding strength. Our adhesive is engineered to perform reliably even in elevated temperature conditions, ensuring durability and stability.

5. Excellent Environmental Resistance:
Face environmental challenges with confidence. Our adhesive exhibits excellent resistance to environmental factors, providing a robust solution for applications exposed to various conditions.

6. Halogen-Free, Low Odor:
Prioritize safety and user comfort with our halogen-free, low-odor formulation. Enjoy peace of mind knowing that your adhesive meets environmental and health standards.

Specifications:

• Cure Time: Quick curing in just 4~6 minutes, providing efficiency without compromising bond strength.
• Strength: Impressive strength values of >16 (AL6061/AL6061) and >15 (SUS304 vs SUS304), ensuring a robust and reliable bond.
• Mix Ratio: A balanced and straightforward mix ratio of 10:1, simplifying your application process.