Holcom Aluminum Thermal Bridge Systems

Product Details

Holcom Thermal Bridge Aluminum System is a high - class aluminum system researched and developed by Holcom. The aluminum profile is designed with many empty spaces, connected together by a Polyamide strip to minimize heat conduction and heat transfer between the inside and outside of the aluminum windows

The product uses the European standard C-groove accessory system

The 5-layer EPDM gasket system helps the door to be tight, smoothly close & open

The superior drainage groove helps the door to dry quickly and prevent moisture in stormy condition

Products suitable for many architectural designs, especially for high-class projects such as villas, offices,hotel....