High TG HASL Lead Free 2 Layers PCB Board SEMSHINE

FOB Price 1 - 100 USD / SQM

MOQ	1 SQM
Port	Shenzhen
Packaging	Inner packing: Vacuum packing,plastic bag Outer packing: Standard carton packing
Lead Time	3-35days

Product Details

Product Description

1. Introduction

As a kind of Double-sided Fr4 pcb, it is widely used in Server, Instruments, Consumer electronics, Automotive electronics etc.
Lead-free DSC Tg>170℃
Excellent thermal reliability
Low Z-CTE
Anti-CAF capability

https://www.shinepcba.com/double-sided-pcb.html

2. Material: High TG Fr4 Laminate pcb

Test Item		Test Method (IPC-TM-650)	Test Condition	Unit	Specification	Typical Value
Thermal	Thermal Stress	24.13.1	Float 288℃/Unetched	Sec	≥10	≥240
	Glass Transition (Tg)	2.4.25	E-2/105 DSC	℃	≥10	175
	CTE/ Z-Axis Expansion	2.4.24	Alpha 1	ppm/℃	≤60	40
			Alpha 2	ppm/℃	≤300	230
			50 - 260 ℃	%	≤3.0	2.6
	X/Y CTE	2.4.24	40℃ - 125℃	ppm/℃	——	12/15
	T-260	2.4.24.1	TMA	min	≥30	＞60
	T-288	2.4.24.1	TMA	min	≥15	＞35
	TD(5% weight loss)	2.4.24.6	TGA	℃	＞340	349
	Flammability	UL94	E-24/ 23	Rating	V-0	V-0
Electrical	Surface Resistivity	2.5.17.1	C-96/35/90	MΩ	≥104	4.2*108
	Volume Resistivity	2.5.17.1	C-96/35/90	MΩ-cm	≥106	6.5*109
	Dielectric Breakdown	2.5.6	D-48/ 50+D0.5/ 23	kV	≥40	≥45
	Dielectric Constant	2.5.5.2	Etched (RC 50%) @ 1 MHz @ 1 GHz	—	≤5.4	4.8
	Dielectric Constant	2.5.5.2	Etched (RC 50%) @ 1 MHz @ 1 GHz	—	≤5.4	4.6
	Loss Tangent	2.5.5.2	Etched (RC 50%) @ 1 MHz @ 1 GHz	—	≤0.035	0.015
	Loss Tangent	2.5.5.2	Etched (RC 50%) @ 1 MHz @ 1 GHz	—	≤0.035	0.016
	CTI	IEC60112	A	V	——	＞175
	Arc Resistance	2.5.1	D-48/ 50+D-0.5/ 23	Sec	≥60	129
Mechanical	Peel Strength (1 oz.)	2.4.8	125 ℃	N/mm	≥0.70	1.2
			Float 288 ℃/ 10 Sec		≥1.05	1.3
			After Process Solution		≥0.80	1.1
	Flexural Strength	2.4.4	Length Direction	N/mm2	≥415	540
	Flexural Strength	2.4.4	Cross Direction		≥345	480
	Moisture Absorption	2.6.2.1	D-24/23		≤0.5	0.09