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| MOQ | 1 pcs |
| Port | SHENZHEN |
| Packaging | Customer settings |
| Lead Time | 5-30days |
Gold OSP 6 layers mobile phone circuit board
Gold OSP circuit board
1) Thickness: 0.1mm-5mm
2) Minimum linewidth：0.075mm/3mil
3) Minimum gap：0.065/2.8mil
4) Minimum aperture inradium：0.15mm
5) Minimum aperture external diameter：0.45mm
6) Minimum BGA: 0.2mm
7) Layer：6 layers through hole non-impedance
All multilayer boards are printed with 36t screen, the resistance welding oil is 50 tons thicker than the traditional 43t, which provides reliability guarantee for the bga and more precise fine lines.
5th Floor, Building F, Hongfa Technology Industrial Park, Tangtou Community, Shiyan Street, Baoan District
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