For Gold Bonding wire
-. Grain of wire surface and section
: Grain size of the improved [IU type]
is bigger than current
Grain size : 35%↑
-. Wire properties
: Yield strength of improved [IU type] : 10%↓
: Hardness of improved [IU type] : 12%↓
Relatively softer than current
-. 2nd Bonding Window
: 2nd window of improved [IU type] is broader at lower para. areas
Easy to deform even by a small force
-. Workability
: MTBA of improved [IU type] shows about two times higher
: The remain areas of improved [IU type] observed more widely
For Silver Bonding wire:
Core Coating Types Concept Target Application Status1N Silver
Gold ACA
. Air Bondable Silver wire
. Cost effectiveness (for Gold)
. Better reliability than Silver alloy
LED, IC Card,
Low-end Memory HVMM MCS
. Air Bondable Silver wire
. Cost effectiveness (for Gold)
. Better reliability than ACA
High-end Memory LVM2N Silver
Gold *ACA2
. Cost effectiveness (for ACA)
. Anti-Discoloration
. Improving workability
LED, IC Card,
Camera module
Low-end Memory
M *GFS
. Ag Purity > 98.5%
. Resistivity < 2.0uΩcm
. Improving workability
High-end Memory UnderDevelopment 2N Silver NA H4
. High conductivity
. Cost advantage
. Stable workability
LED, Low-end IC HVM
For Copper bonding wire :
Core Coating Types Concept Reliability level (Target) Status2N
Copper
Non CA
. Better reliability for
Automotive
. Workability [AEC-Q006_Grade.0]
HTST : 175DegC/4,000hrs
uHAST : 130DegC,RH85%/500hrsHVMGold
Palladium
HAP . Enhanced reliability
for Automotive HVM3N
Copper *HAP2 . Reliability improved
. Resistivity < 2.0uΩcm
[JEDEC] +
HTST : 150DegC/1,000hrs
uHAST : 130DegC,RH85%/168hrsLVM4N Copper
PC . Low Pd coated wire
. Workability HVMX (Metal) *NC2 . Low Pd
. Better Reliability
High Purity
Copper Non LV2 . Property customized
for Ball Shape