Foam glass thermal insulation panel

Product Details

Foam glass thermal insulation panel

Foam glass is an inorganic thermal insulation material with a porosity of more than 90%. It is made of glass as the main raw material, which is pulverized, mixed with additives and foaming accelerators, and then melted, foamed and annealed at high temperature. Inorganic closed-cell insulation material.

Foam glass insulation board is suitable for thermal insulation, waterproof and fireproof of various buildings, the long-term use performance is not reduced, and the service life is synchronized with the building. Due to its many outstanding features, it is suitable for thermal insulation of roofs and walls of various types of industrial and civil buildings; thermal insulation in cryogenic, high temperature and corrosive environments; thermal insulation in constant temperature and humidity machine rooms and laboratories hot. It has superior performance, durability, moderate cost, high comprehensive economic benefits and convenient construction. It is a safe, reliable and durable building energy-saving thermal insulation material.

Product Features

Low density, low thermal conductivity, high compressive strength

Non-absorbent, moisture-proof, anti-leakage;

Inorganic products, do not age, performance does not decline, the service life is synchronized with the building

No burning; no mildew, corrosion resistance

It is non-toxic by itself and does not contain CFC (chlorofluorocarbon) and HCFC (hydrochloric acid);

Suitable for harsh environments such as high temperature, cryogenic, constant temperature, and constant humidity

Physical and chemical properties are stable, dimensionally stable, and easy to cut.

Recycling, non-toxic and harmless, safe and environmentally friendly;

Performance index of foam glass plate

Density kg/m3 120±8 140±8 160±10

Thermal conductivity W/(m·K) ≤0.042 ≤0.048 ≤0.052

Compressive strength Mpa ≥0.8 ≥1.2 ≥1.6

Flexural strength ≥0.5 ≥0.8 ≥1.0

Tensile strength ≥0.2 ≥0.3 ≥0.4

Volume water absorption, (V/V), % ≤0.5 ≤0.5 ≤0.5

Dimensional stability, % ≤0.3 ≤0.3 ≤0.3