|
Main
chip
|
RK3568
|
CPU
|
ARM®
Quad-core 64-bit processor, Quad-core Cortex-A55
|
GPU
|
ARM
G52 2EE
Support OpenGL ES
1.1/2.0/3.2,OpenCL 2.0,Vulkan 1.1
|
Video
Processor
|
Support 4K VP9
and 4K 10bits H265/H264 video decoding, up to
60fps
1080P
multi-format video decoding (WMV, MPEG-1/2/4,
VP8)
1080P
video encoding, support H.264, VP8
format
Video
post processor: de-interlacing, denoising,
edge/detail/color optimization
|
Power
Management
|
RK808
PMU Power Management Unit
|
RAM
|
8GB
dual channel 64Bit LPDDR4(1GB/2GB/4GB/8GB
optional)
|
Storage
|
Up to
128GB high-speed eMMC (16GB/32GB/64GB/128GB
optional)
|
Hardware
Features
|
Ethernet
|
Integrated GMAC
Ethernet Controller*2
10/100/1000-Mbps
data transfer rate supported using RGMII
interface
10/100-Mbps data
transfer rate Supported using RMII interface Support to
expand Realtek RTL8211E to achieve 10/100/1000Mbps
Ethernet
|
Wireless
network
|
SDIO
interface for expanding WiFi&Bluetooth 2-in-1
module
Support 2.4GHz /
5GHz dual-band WiFi, 802.11a/b/g/n/ac protocol
|
Display
|
Video
output interface:
1 x
HDMI 2.0, support 4K@60HZ output and HDCP
1.4/2.2
Display interface
(support dual-screen simultaneous display, dual-screen
different display):
1 x
MIPI-DSI, support dual channel 2560x1600@60fps
output
|
Audio
|
1 x
HDMI 2.0 and 1 x DP 1.2 (DisplayPort), Audio
Out
1 x
SPDIF digital audio interface for audio output
|
Camera
|
1 x
MIPI-CSI camera interface (built-in dual hardware ISP, up
to single 13Mpixel or dual
8Mpixel)(developer
mode)
|
PCIE
|
1 x
PCIe2.1 interface
|
Power
|
12V
(voltage error ±5%)
|
USB
|
USB3.0 × 2
|
Debug
|
Debug
serial port × 1 for development and debugging
|
Interface
|
3 ×
SDMMC, 3 × SPI, 10 × UART, 6 × I2C x 6, 2 ×
I2S/PCM(2ch)/TDM(8ch),16×PWM ,7 × ADC, 3 × CAN, 130 ×
GPIO
|
Power
Dissipation
|
Standby power
dissipation:0.015W
Typical power
dissipation: 2.9W
Maximum power
dissipation: 5.6W
|
Environment
|
Working
temperature: -10℃- 50℃
Storage
temperature: -40℃- 85℃
Storage humidity:
10%~80%
|
System
software
|
Core
Board Size
|
82mm
× 50.5mm (plate thickness 1.2mm)
|
Interface
Type
|
MXM3.0 (314 PIN,
0.5mm pitch)
|
PCB
Specification
|
8-layer board
design, immersion gold process
|
Hardware
Encryption
|
Hardware Support
for Symmetric Algorithms
SHA-256 & HMAC
Hash including off-chip context
save/restore
AES-128:
Encrypt/Decrypt, Galois Field Multiply for GCM
|