MOQ | 1 Piece/Pieces |
Port | Shenzhen |
Packaging | Standard plywooden box. Dimesion: 760*680*680mm Dinghua DH-5860 Mobile Phone BGA Rework Station |
Lead Time | - |
Type | Soldering Station | Condition | New |
Place of Origin | Guangdong, China (Mainland) | Brand Name | Dinghua(BGA Rework Station) |
Dimensions | 800x900x750mm | Weight | 48KG |
Usage | Repair all kinds of bga chip set | Certification | CE, ROHS, UL |
After-sales Service Provided | Free spare parts, Field installation, commissioning and training, Field maintenance and repair serv | Warranty | 3 years |
Product name | Dinghua DH-5860 Mobile Phone BGA Rework Station | Level | Manual + Touch screen |
PCB size | Max 500*400 mm Min 22*22 mm | Machine type | Superior PCB motherboard repair station |
Application | All kinds of BGA chips or motherboard | Positioning | V-shape card slot, PCB holder can be adjustable by X and Y axes |
Temperature control | K-type thermocouple closed loop control, independent temperature | Function | reballing, repair motherboards, BGA, laptop chip, mobile phone chip |
Heating | 3 independent heating zones | Available BGA chip | 2*2mm-80*80mm |
4th Floor, Building 6B, Shengzuozhi Industrial Park, Xinyu Road, Shajing, Baoan, Shenzhen