CIB Process Ultra Thin Camera Module

Product Details

CIB process: Hollow FPC is used, that is, the DB area of FPC is hollowed out in advance, and then the bottom of Die is flush with the bottom of FPC, and the gap between FPC and Die is filled with glue for curing treatment, so that Die is fixed at the bottom of FPC.

Compared with the COB process, the biggest difference is the packaging location of Die. The COB packaging process is to fill the DB area of FPC with glue, then attach Die to the FPC with glue, and then solidify the glue so that Die is tightly attached to the FPC.