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| MOQ | 1 Piece/Pieces |
| Model Number | PCB/PCBA | Place of Origin | Guangdong, China |
| Supplier Type | OEM | Layer No. | 2-32 Layers |
| PCB Test | Flying probe and AOI (Default)/Fixture Test | Base, Cover film, Stiffeners thickness: | 0.5mil, 1.0mil, 2.0mil, 3.0mil, 4.0mil, 5.0mil, 6.0mil,0.10um |
| BGA Ball Pitch | 1mm ~ 3mm(4mil ~ 12mil) | PCB Assembly Method | SMT, Through-hole, Mixed, BGA |
| PCB Assembly Test | Visual Inspection (default), AOI, FCT, X-RAY | Hi-TG FR4 Material | Tg-130 Tg-140 Tg-160 Tg-170 |
| Electrical Testing | Net List Test, Flying Probe Test, Through Hole Test, Dual Access Test | Certificate Standard | IPC-A-600H Class 2, Class 3, TS16949,ROHS and as your need |
| Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering etc. |
Room 10A16, 10/F, Yilida Building 2, Nanshan Road, Nanshan District
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