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| MOQ | 1 piece |
| Packaging | vacumm packing |
| Lead Time | 2-3 weeks |
Supplier: Shenzhen Da Electronics Number of layers: 4
Application: Telecommunication equipment wireless circuit board manufacturing. Telecommunication circuit board manufacturing. Large electronic products
PCB parameters: F-4/HP-150 Thickness: 1.6mm Surface treatment: ENG
Testing: 100% electronic testing Packaging: Vacuum packaging Delivery time: 10-15 days
describe:
PCB capacity
Number of layers: 1-30
Quantity: 25,000 square meters/month
PCB Type: Silicon Pentoxide High Suspension Copper, Impedance Board, HDI, High Frequency Board, Aluminum, FPC, Rigid Flexible Circuit Board
Basic material brand
H: Rogers, Tacony
HTG: S1000-2M, Lianmao IT180A
Welding mask: Taiyue PSR-2000/4000 series
Surface treatment: HASL, IMU, OSP, IMS, IM silver, 50-inch hard gold plating
Mixed surface treatment: OSP+OSP, gold finger+gold finger, gold finger+gold finger
Polychlorinated biphenyls technical parameters
最小走线宽度/间距：外部 2.5/2.5mil，内部 3/3mil(1/3, 1/2oz)
（激光）
机械环：4英里
最大铜厚：7℃
最大尺寸：650x1100mm
厚度与孔径比：20:1
甲状旁腺激素抵抗
：+/-0.0075mm（简单：+/-0.05mm）
仅：+/-0.1mm（简单：+/-0.05-0.075mm）
Room A510-512 Car Building, No.45 Zhenhua Road,, Futian District, Shenzhen, China 518031
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