Quantity | 1 - 10 | 11 - 1000 | 1001 - 100000 |
Price | 1.88 | 1.66 | 1.11 |
MOQ | 1 piece |
Port | Shenzhen, Hongkong |
Packaging | Vacuum Packaging |
Lead Time | 3-7 days |
Brand Name | PEAK PCB | PCB Type | Regular Multilayer PCB |
Number of Layers | 4 Layers (Max 64 Layers) | Finished Thickness | 1.6 mm (Max 8mm) |
Base Material | FR4 TG170 | Finished Inner Copper Thickness | Hoz (Max 14oz) |
Finished Outer Copper Thickness | 1oz (Max 14oz) | Min. Mechanical Hole | 0.2mm (Min 0.1mm) |
Min. Line Width | 3.4 mil (Min 2mil) | Min. Line Spacing | 3.4 mil (Min 2mil) |
Surface Finishing | ENIG 1u | Solder Mask | Green |
Silk Screen | White | Thickness Tolerance | ±10% |
Impedance Control Accuracy | ±10% (min±5%) | Outline Profile | Rout/ V-cut/ Bridge/ Stamp Hole |
Testing Service | 100% AOI ICT FCT Testing | Special Processes | No |
PCB Standard | IPC-A-610 E Class II | Application | Electronics Device |
Supply Ability | Sample and Mass Production | Place of Origin | Guangdong, China |
Packaging Inner | Vacuum Packing/ Anti-Static Package | Packaging Outer | Export Carton/ Customizable |
Port | Shenzhen, Hongkong | Acceptable File Format | Gerber file, Powerpcb, CAD, AUTOCAD, ORCAD, P-CAD, CAM-350, CAM2000 |
Up to 64 Layers;
FR4 TG135/TG150/TG170;
Halogen Free/CTI≥600;
Aspect Ratio (Finish Hole) 28:1;
Sample Expedited 8 Hours(1-2Layer);
Blind/Buried/Hybrid Via;
5+N(N+M)+5 Structure;
Trace Width/Spacing 1.6/1.6mil;
Laser Hole Size(mm)≥0.075;
High Density Interconnector;
More than 85+ Types;
Rogers/Arlon/Taconic/Isola/
Nelco/F4B Serices,etc;
Materials can be Specified;
Impedance Tolerance ±5%(min);
Panasonic Megtron4/6/7;
TU-872SLK/Isola-FR408HR,etc;
Impedance Tolerance ±5%(min);
Dimension Accuracy ±0.02mm(min);
Line Width/Space Accuracy ±5%;
Thermal Conductivity 1-398W/m.K;
Aluminum/Copper AC 500-4000V;
Post-bonding/Pre-bonding;
Sweat-Soldering/Conduct Adhesive;
Press-Fit/Embedded Coin(I, T U);
2-24 Layers;
Book/Air-gap/Fly-tail;
Unsymmetrical/Semi-Flex;
Width of Flexible Zone 3mm(min);
Dimension Accuracy ±0.05mm(min);
CSP/FC-CSP/SIP/FC-BGA/WB-CSP;
FR4/BT/High-Speed Material;
Trace Width/Space 12/12μm;
SM Registration:±20μm;
Strict SM Flatness Control ≤5μm;
Ceramic/Glass Material;
Hybrid Material Lamination;
Buried Capacitance/Resistance;
PTH/NPTH Step Slots;
Uneven/Segmented/Step Gold Finger;
Founded in 2007, PEAK Co.,Ltd is an electronic solutions company offering 1-64 layers PCB fabrication, assembly, testing & validation of rigid, rigid-flex, HDI, high frequency, high speed, metal core, IC substrate, substrate-like and other special PCB. Our modern 54,000 square foot manufacturing facility allows us to provide all rigid & rigid-flex services under one roof and offer quick-turn capabilities. PEAK has a professional reputation for developing high-performance solutions for technically advanced OEM’s in a variety of markets including aerospace and defense, medical, computer, communication, server, semiconductor IC, automotives, industrial control, optoelectronics, LED and others.
5th floor, building D, Zhongxi Industrial Park, Gonghe village, Shajing Town, Bao'an District, Shenzhen