BERGQUIST SP900S SIL PAD TSP 1600S BERGQUIST SIL PAD TSP 1600S

Product Details

BERGQUIST SP900S, SIL PAD 900S, SIL PAD TSP 1600S

The true workhorse of the SIL PAD product family, SIL PAD900S (SP900S)thermally conductive insulation material

is designed for a wide variety of applications requiring high thermal performance and electrical isolation.

These applications also typically have low mounting pressures for component™clamping.

SIL PAD 900S (SIL PAD TSP 1600S)material combines a smooth and highly compliant surface characteristic with

high thermalconductivity. These features optimize the thermal resistance properties at low pressures.

Applications requiring low component clamping forces include discrete semiconductors (TO-220, TO-247

and TO-218) mounted with spring clips. Spring clips assist with quick assembly and apply a limited amount

of force to the semiconductor. The smooth surface texture of SIL PAD 900S minimizes interfacial thermal

resistance and maximizes thermal performance.

Typical Applications Include:

• Power supplies

• Automotive electronics

• Motor controls

• Power semiconductors

Configurations Available:

• Sheet form, die-cut parts and roll form

• With or without pressure sensitive adhesive