BCM85110IFSBG MaxLinear

Product Details

The BCM85110IFSBG by MaxLinear is a highly integrated RF System-on-a-Chip (SoC) engineered for the most demanding wireless communication environments. By consolidating advanced RF front-end capabilities, mixed-signal processing, and digital baseband functions into a single BGA package, this SoC streamlines complex system architectures and sets a new benchmark for performance in modern wireless infrastructure.

Key Technical Highlights

• Ultimate Integration: The BCM85110IFSBG eliminates the limitations of discrete RF solutions by integrating critical signal paths and processing units on a single silicon die. This drastically reduces the bill of materials (BOM), minimizes PCB footprint, and simplifies routing complexity.

• Robust Silicon Provenance: Manufactured using MaxLinear’s mature silicon (Si) process, this chip delivers high-performance, wide-bandwidth communication while maintaining an optimal balance between cost, power efficiency, and integration density.

• Optimized for Harsh Environments: Designed to excel in challenging deployment scenarios—from macro base stations and small cells to high-capacity microwave backhaul and E-band communication systems—the BCM85110IFSBG ensures superior signal purity and interference immunity.

• Compact & Efficient Design: The BGA package provides high pin density with excellent electrical characteristics and thermal conductivity, meeting the rigorous requirements of industrial and telecommunications-grade hardware.

Target Applications

• • Wireless Infrastructure: Serving as the heart of transceiver units for macro and small cell base stations.

  • Broadband Wireless Access: Enabling high-bandwidth connectivity for microwave backhaul and E-band systems.

  • Point-to-Point Industrial Radio: Supporting high-capacity, long-distance data links in enterprise and carrier networks.

  • Precision Test & Measurement: Providing high-fidelity RF core processing for signal generators and spectrum analyzers.