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| MOQ | 5 Piece/Pieces |
| Place of Origin | China | Brand Name | Gesp Technology |
| Model Number | Customized | Base Material | FR-4/aluminum/ceramic/cem-3/FR-1, FR-4/aluminum/ceramic/cem-3/FR-1 |
| Copper Thickness | 0.25 Oz -12 Oz | Board Thickness | 0.005"-0.250" |
| Min. Hole Size | 0.2mm | Min. Line Width | 0.1mm |
| Min. Line Spacing | 0.1mm | Surface Finishing | HASL Lead Free/OSP/Soft Gold/Hard Gold, HASL Lead Free/OSP/Soft Gold/Hard Gold |
| Standards | IPC Class 2, Class 3 | Application | Electronics Device/Automotive/Semiconductors/Consumer Electronics |
| Certificate | ISO/U-L/RoHS/TS16949 | Testing Service | E-test or fly-probe according to order quantity |
| Solder Mask | Green/blue/black/red/yellow/white | Silk Screen | White/Black/Yellow |
| Controlled Impedance | Yes or no according to the gerber file | Blind & Buried vias | Yes or no according to the gerber file |
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