3D Wirebond, Die Bond, Post Mold AOI Solution

Product Details

Vega is a High Precision Wirebond AOI solution equipped with the latest & high-specification 3D technologies which able to perform a smarter and high accuracy height measurement inspection on the die and on fine wirebond. It's designed to support inspection before and after the wire-bonding process. It has the capability to perform 3 types of product (Leadframe, Substrate & Pallet) inspection with only a few steps of recipe change. With 3D technologies, it has the ability to detect defects such as wire drop, die tilt, and more. It comes with a multi-choice of reject modules that suit your need, for example, laser marking, laser cutting, inking, and Pick&Place.