2microns Silver Powder for conductive paste

Port	Ningbo,China
Packaging	Aluminum foil bag

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Product Details

Application

Apply to manufacturing the thick-film conductive pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cell.

Features

• Good dispersibility

• Low shrinkage

• High crystallinity

• Good electric conductivity

• Good filling property

Product specification

Specification	Mean Particle Size(μm)	Specific Surface Area(m2/g)	Particle Size Distribution（μm）				Tap Density(g/cm3)
Specification	Mean Particle Size(μm)	Specific Surface Area(m2/g)	D10	D50	D90	D99	Tap Density(g/cm3)
Ag-S0400	0.38-0.45	1.27-1.50	0.17-0.25	0.45-0.58	0.85-1.02	2.30-2.80	≥4.2
Ag-S0800	0.82-0.95	0.60-0.70	0.55-0.80	0.90-1.30	1.40-2.80	3.50-6.80	≥4.6
Ag-S2000	1.80-2.20	0.25-0.32	1.00-1.40	2.00-2.65	3.80-5.20	7.20-10.00	≥5.0
Ag-F0801		1.30-1.50	0.30-0.60	0.65-0.95	1.30-1.50	3.30-3.70	≥3.3
Ag-F2001		0.80-0.90	1.00-1.30	1.80-2.30	3.50-5.00	7.50-9.00	≥4.0