200-2000nm silver powder/silver nanoparticles

MOQ	100 gram
Port	Ningbo Port
Packaging	Aluminum foil bag with inert gases inside
Lead Time	within 3-7 days

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Product Details

Silver Powder

Application

Apply to manufacture the sintering thick-film conductor pastes, such as the pastes for the internal and external electrodes of multi-layered component and circuit board (LTCC), PDP, HIC and solar cells.

Products Features

1. Good dispersion property

2. Low shrinkage

3. High crystallinity

4. Good electric conductivity

5. Good fillibility

Product specification

Specification	Mean Particle Size (μm)	Specific Surface Area (m2/g)	Particle Size Distribution (μm)			Tap Density (g/cm3)
Specification	Mean Particle Size (μm)	Specific Surface Area (m2/g)	D10	D50	D90	Tap Density (g/cm3)
Ag-GB0400	0.38-0.45	1.27-1.50	0.17-0.25	0.45-0.58	0.85-1.02	≥4.2
Ag-GB0800	0.82-0.95	0.60-0.70	0.55-0.80	0.90-1.30	1.40-2.80	≥4.6
Ag-GB1000	0.99-1.12	0.51-0.58	0.58-0.85	1.00-1.50	1.80-3.00	≥5.0
Ag-GB1500	1.25-1.80	0.31-0.46	0.85-1.50	1.60-2.50	3.20-4.50	≥5.0
Ag-GB2000	1.80-2.20	0.25-0.32	1.00-1.40	2.00-2.65	3.80-5.20	≥5.2
Ag-F0801	-	1.10-1.40	0.48-0.68	0.95-1.25	2.20-2.60	≥4.3
Ag-F2001	-	0.65-0.85	1.80-2.30	3.20-3.70	5.20-5.70	≥4.0