10/20PPI porous copper metal foam for catalysts and electrode materials

Product Details

Copper foam, characterized by its microporous structure and unique physical and chemical properties, finds widespread applications in various fields. With its lightweight structure and excellent electrical conductivity, copper foam has become a versatile material of choice.

Parameters

Number of holes: 10/20 PPI (10-120 can be customized)

Bulk density: 0.15-0.45 g/cm3

Size: 100*100*10mm thickness/ 100*100*20mm thickness

Porosity: 90-98%

Thermal Conductivity (Theoretical): >6W/M.K

Mechanical Strength (Theoretical):≥2.5MPa

Tensile Strength (Theoretical): 5-18MPa

Features

Lightweight Structure: Copper foam's microporous structure provides it with an extremely low density, making it remarkably lightweight. This quality makes copper foam highly valuable in weight-sensitive applications, such as the aerospace and automotive industries.

Excellent Electrical Conductivity: Copper foam exhibits outstanding electrical conductivity, enabling efficient conduction of both current and heat. This attribute makes it widely used in electronic equipment, radiators, and electromagnetic shielding applications.

High Plasticity: Copper foam possesses excellent plasticity, allowing it to be easily shaped and formed into various sizes and geometries. This feature makes it highly suitable for manufacturing components with complex structures, including filters, sound-absorbing materials, and thermal insulation materials.

Superior Corrosion Resistance: Copper foam demonstrates strong resistance to corrosion, protecting it from the detrimental effects of humidity, chemicals, and oxidation. This property makes it extensively employed in marine engineering, chemical industries, and environmental protection applications.

Applications

Electronic Equipment: Copper foam finds wide usage in electronic equipment, including circuit boards, heat sinks, and electromagnetic shielding materials. Its excellent electrical conductivity and heat dissipation properties contribute to enhanced device performance and stability.

Aerospace: Copper foam's lightweight structure and high strength make it an ideal material for aerospace applications. It is utilized as a structural material and thermal insulation material, reducing aircraft weight and providing effective thermal insulation.

Filtration: The microporous structure of copper foam makes it an excellent filter material. It is employed in liquid and gas filtration systems, removing impurities and solid particles. Applications include water treatment, air purification, and automobile emission control.

Acoustic Materials: Copper foam's plasticity and sound-absorbing properties make it a valuable material for acoustic applications. It can be used in the production of audio equipment, acoustic isolation materials, and noise control products, delivering exceptional acoustic performance.