Weighing Scales PCB Assembly Services | Printed Circuit Board Assembly | Grande

Supplier: Shenzhen Electrical Appliances

Number of layers: 4

PCB: fr-4/1.6mm, full 1 oz. copper

Application: Electronic Scale PCB Collaboration Service | PCB Components | Large

Surface polishing:

Feeding time: 3-4 weeks

Packaging: anti-static bag and partition packaging

Twist:＜0.75%

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Supplier: Shenzhen Electrical Appliances

Number of layers: 4

PCB: fr-4/1.6mm, full 1 oz. copper

Application: Electronic Scale PCB Collaboration Service | PCB Components | Large

Surface polishing:

Feeding time: 3-4 weeks

Packaging: anti-static bag and partition packaging

Twist:＜0.75%

PCB parameters: DB2/HP-150 Thickness: 1.6mm Surface treatment (such as testing: 100% electronic testing Packaging: vacuum packaging Delivery time: 10-15 days).

【Description】
1, PCBA turnkey solution for Weighing Scales PCB Assembly Services | Printed Circuit Board Assembly | Grande.
2, PCB Assembly, PCB fabrication / PCB layout, PCB re-layout.
3, Electronic Manufacturing Service.
4, SMT&DIP&PTH&BGA.
5, Components Sourcing.
6, Quick PCBA prototype.
7, X-ray test, the Internal Circuit Test (ICT) , Function Test (FCT)
8, Sample and small batch order are accepted.




PCBA Service
Customer offers: Gerber file, PCB Specification, BOM and Assembly Drawing.
Full-turnkey PCBA: 1-30Layers PCB, Components Sourcing, SMT, PCBA testing, PCBA Aging test, PCBA Packing and PCBA Shipping.


PCBA Quality Assurance
1, Certifications: UL, SGS, TUV, BV, ROHS, ISO9001: 2008, TS16949: 2008
2, 7 lines dust-proof SMT lines and DIP lines.
3, All line workers wear anti-static and dust-proof clothing.
4, All operators should pass strictly training before they start work.
5, SMT Equipment：solder paste printer in Jidakang,, Mounter in Panasonic, Re-flow, Wave Soldering and Semi-auto DIP
6, PCBA Test Equipment: ORT, Constant temperature and humidity chamber，3D CMM，X-Ray.
7, PCBA Test：ICT, Functional Circuit Test and X-ray test.
8, Package Processed：
0402, 0603, 0805, 1206, 1608, 2125, 3216
Micro QFP 0.2mm
Flip-chip, BGA, Connectors
BGA Ball Pitch=0.2mm
9, Each workstation in accordance with the SOP

10. Material: FR-4, FPC, aluminum, high TG, halogen-free, HF, CEM-1, CEM-3, FR-1, 94-V0, etc.

11. Material brands: KB, Shengyi, Nanya, etc.

Delivery time: After fulfilling the contract and confirming EQ

7-10 times a week.

Mass production: Bulk shipment according to customer requirements.