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Waffle Pack Bare Die Tray Optical Device Packaging

PortSHENZHEN, China
Packagingcartons packaging
Lead Time5days

Product Details

Waffle Pack Bare-Die Trays Standard For Bare Wafer

In order to better protect the components or chips, choosing injection trays for packaging has become an alternative and option packaging solution. It can not only provide comprehensive protection for components, but also provide excellent products in terms of storage and transportation. Great advantage of convenience. At the same time, due to the reusable characteristics of plastic pallets, the products we produce can also be reused, and the waste of plastic after disposal can also be fully degraded, thereby eliminating some of the problems that need to be dealt with by environmental protection. Our company can Provide one-stop service from design to production to packaging, solve all the problems faced by packaging for your parts, choose high-quality professional suppliers, and reduce unnecessary after-sales troubles for you.

View File

Waffle pack opening procedure discrete devices packaged in Waffle Packs normally have room to move around within the pocket. Sometimes parts may stick to the paper insert usually placed between the top of the package and the lid. Parts can easily jump out of an open package subject to small vibrations, static charge or strong airflow. Smaller parts are more susceptible to jumping out of, or being blown out of, the pockets of an open waffle pack.

Waffle Pack Bare-Die Trays Detail Information:

Usually used for loading small chips or components less than 13mm, carrying a large number of chips in a small volume. At the same time, the purchase of inch products can match the corresponding accessories such as cover, clip and Tyvek paper of the existing series, and the complete package is more easy to the transfer, transport and storage of the products.

Outline Line Size 101.57*101.57*3mm Brand ESDGoods
Model Package Type IC Parts
Cavity Size 13*13mm Matrix QTY 6*6=36PCS
Material ABS Flatness MAX 0.3mm
Color Black Service Accept OEM,ODM
Resistance 1.0x10e4-1.0x10e11Ω Certificate ROHS


Waffle Pack Bare-Die Trays Product Application

Wafer Die / Bar / Chips PCBA module component
Electronic component packaging Optical device packaging


Packaging


Packaging Details:Packing according to customer's specified size

Our Advantages

1. Flexible OEM service: we can produce products according to customer’s sample or design.

2. Various Materials: the material can be MPPO.PPE.ABS.PEI.IDP...etc.

3. Complicated workmanship: tooling making, Injection molding,Production

4. Comprehensive customer service: from customer consultation to after sales service.

5. 10 years’ex perience of OEM for USA and EU customers.

6. We have our own factory and can control quality in high level and produce products quickly and flexibly.

Outline Size Material Surface Resistance Service Flatness Color
2" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.2mm Customizable
3" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.25mm Customizable
4" ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM Max 0.3mm Customizable
Custom size ABS.PC.PPE...etc 1.0x10e4-1.0x10e11Ω OEM,ODM TBC Customizable
Provide professional design and packaging for your products
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